Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.

Abstract: Multi-component modules (MCMs), including configurable electromagnetic interference (EMI) shield structures and related methods, are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with sidewall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The sidewall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.

Abstract: Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.

Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.

Abstract: A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first pad interconnect. The first pad interconnect comprises a first portion comprising a first width and a second portion comprising a second width that is different than the first width.

Abstract: A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.

Abstract: Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical connection between the first side and the second side of the semiconductor package.

Abstract: Systems and methods for lead frame-based chip carriers for use with MEMS transducers. One embodiment provides a method for manufacturing a MEMS microphone package. In one exemplary embodiment, the method includes flip chip bonding a first plurality of I/O pads on an application specific integrated circuit to a plurality of traces on a lead frame. The method further includes removing at least one of the plurality of traces such that at least one of the first plurality of I/O pads is electrically isolated from the lead frame. The method further includes bonding the lead frame to a lid and electrically connecting, via at least one wire bond, a MEMS microphone mounted to the lid to the application specific integrated circuit using a second plurality of I/O pads of the application specific integrated circuit. The method further includes bonding a substrate to the lead frame to form an air tight volume within the lid.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical convection between the first side and the second side of the semiconductor package.

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

Abstract: Systems and methods for lead frame-based chip carriers for use with MEMS transducers. One embodiment provides a method for manufacturing a MEMS microphone package. In one exemplary embodiment, the method includes flip chip bonding a first plurality of I/O pads on an application specific integrated circuit to a plurality of traces on a lead frame. The method further includes removing at least one of the plurality of traces such that at least one of the first plurality of I/O pads is electrically isolated from the lead frame. The method further includes bonding the lead frame to a lid and electrically connecting, via at least one wire bond, a MEMS microphone mounted to the lid to the application specific integrated circuit using a second plurality of I/O pads of the application specific integrated circuit. The method further includes bonding a substrate to the lead frame to form an air tight volume within the lid.

Abstract: A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.