Patents by Inventor Jaycee H. Chung

Jaycee H. Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5728258
    Abstract: An apparatus for applying non-gravitational pressure to a surface includes a frame structure having a longitudinal axis, a pair of connecting members coupled to the frame structure along parallel axes normal to the longitudinal axis of the frame structure, vacuum fasteners coupled to the connecting members to secure the frame structure on an underlying surface, a vacuum pump mounted on the frame structure for activating the vacuum fasteners and a positive pressure pump mounted on the frame structure for inflating a collapsible diaphragm to apply pressure to the underlying surface. The apparatus is useful for applying doublers to aircraft repair localized damage.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: March 17, 1998
    Assignee: E-Systems, Inc.
    Inventor: Jaycee H. Chung
  • Patent number: 5312520
    Abstract: To prepare a metallic surface for adhesive bonding, surface irregularities and contaminants are removed. This first step is followed by repeated cleaning of the metallic surface with a solvent and testing of the metallic surface for uniformity. Next, new surface material is exposed by blasting or abrading the surface material. Subsequently, the surface is cleaned and again tested for uniformity. Finally, the surface is treated with a silane solution and dried prior to bonding.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: May 17, 1994
    Assignee: E-Systems, Inc.
    Inventor: Jaycee H. Chung