Abstract: The invention provides an optical connection between a component on a printed circuit board (“PCB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Abstract: The invention provides an optical connection between a component on a printed circuit board (“PCB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Abstract: The invention provides an optical connection between a component on a printed circuit board (“PUB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Abstract: A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.

Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

Abstract: A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

Abstract: A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

Abstract: According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are also described.

Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

Abstract: According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are also described.

Abstract: To mount electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are described.

Abstract: According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are also described.