Abstract: Systems and techniques for supplementing wire bonds. In one embodiment, a device includes a body having a first surface, a first wire bond pad disposed on the first surface, a first wire that is wire bonded to the first wire bond pad to form a contact between the first wire and the first wire bond pad, a first supplemental conductor disposed to form a supplemental conduit between the first wire and the first wire bond pad, a second wire bond pad disposed on the first surface, a second wire that is wire bonded to the second wire bond pad to form a contact between the second wire and the second wire bond pad, and a second supplemental conductor disposed to form a supplemental conduit between the second wire and the second wire bond pad. The first supplemental conductor is discrete from the second supplemental conductor.