Abstract: In an embodiment a power supply system includes a low voltage DC/DC converter (LDC) configured to convert a high voltage into a low voltage, a main battery configured to be charged by the LDC and to supply power to a junction block divided into an essential load part and a general load part, a control block comprising a first power switch configured to control power between the LDC and the junction block, a second power switch configured to control the power between the main battery and the junction block, and a load switch configured to selectively cut off the power to the general load part and an auxiliary battery configured to selectively supply power to an auxiliary junction block.

Abstract: Disclosed herein is a separator for electrochemical devices, configured to guarantee electrical insulation between a positive electrode and a negative electrode, wherein the separator includes no polyolefin substrate, and includes inorganic particles, a binder for coupling between the inorganic particles, and a crosslinking agent.

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.

Abstract: Disclosed herein is a porous separator for electrochemical devices, configured to guarantee electrical insulation between a positive electrode and a negative electrode, wherein the porous separator includes no polyolefin substrate, and includes inorganic particles, a binder for coupling between the inorganic particles, and a crosslinking agent.

Abstract: A display device includes a substrate, a first electrode disposed on the substrate, an organic light-emitting layer disposed on the first electrode, a second electrode disposed on the organic light-emitting layer, an encapsulation layer disposed on the second electrode, and a touch layer disposed on the encapsulation layer. The encapsulation layer includes a first inorganic layer, a first organic layer, a second organic layer, and a second inorganic layer. The first inorganic layer is disposed on the second electrode, the first organic layer is disposed on the first inorganic layer, the second organic layer is disposed on the first organic layer and has a greater ring parameter than the first organic layer, and the second inorganic layer is disposed on the second organic layer.

Abstract: The inventive concept relates to an apparatus and a method for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.

Abstract: Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Abstract: The inventive concept relates to an apparatus and a method for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber configured to form a treatment space, a gas supply unit configured to supply a process gas into an interior of the process chamber, a plasma generating unit configured to generate plasma from the process gas introduced into the interior of the process chamber, and a substrate support unit provided in the treatment space and configured to support a substrate, the substrate support unit may include a first plate, and a second plate that is adjacent to the first plate, and a gap may be formed between the first plate and the second plate, and a supply pipe is configured to supply a gas into the space defined by the gap.

Abstract: Provided are a substrate storage apparatus and a substrate processing apparatus using the substrate storage apparatus. The substrate storage apparatus includes a housing having a loading/unloading port for loading/unloading of a substrate and configured to provide a loading space for a loaded substrate, a separation membrane coupled to the housing to divide the loading space into a plurality of separation spaces isolated from each other, a gas supplier configured to supply a purge gas into the loading space to clean the substrate, a gas discharger configured to discharge the purge gas accommodated in the loading space, and a controller configured to control supply and discharge of the purge gas for each of the plurality of separation spaces.

Abstract: The inventive concept relates to an apparatus for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.

Abstract: Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.

Abstract: Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.

Abstract: According to the present invention, a reaction-type turbine includes: a housing including a housing passage between an inlet and an outlet; a turbine shaft rotatably coupled to the housing to transmit torque; and at least one nozzle assembly coupled to the turbine shaft and rotatably provided in the housing passage. The nozzle assembly includes circumferential injection holes therein for injecting a high-pressure fluid in a circumferential direction and generating torque. Accordingly, when turbines having different capacities are manufactured, common parts can be compatibly used and assembling efficiency is improved. In addition, the eccentric rotation of the turbine shaft is prevented to significantly improve the durability of the reaction-type turbine. Furthermore, since the injection holes are long, the reaction-type turbine can be miniaturized and the efficiency thereof is improved.