Abstract: The device and its methods, and how the invention's purpose is to input for electronic contracts using a communications network will be introduced. The present invention uses a communications network as a medium and proves contract application from the service server. When the received contract application is activated, a control medium is used to synchronize the terminals of involved electronic contract parties via the terminal set synchronization code. When the terminals are synchronized, display of notification icons to let the other involved party know of input fields within the electronic contract.

Abstract: Disclosed herein is a door of an electric oven, which has an improved configuration to prevent the escape of heat from a cooking compartment to the outside during cooking or self-cleaning of the cooking compartment. The door, which serves to selectively open or close a cooking compartment of an electric oven, includes a front glass installed to a front surface, a rear glass installed behind the front glass, and a porous plate interposed between the front glass and the rear glass. The porous plate serves to prevent the escape of heat from the cooking compartment to the outside and includes a plurality of view holes to enable observation of the cooking compartment from the outside.

Abstract: An image forming apparatus capable of minimizing a temperature rise of a cover is disclosed. The image forming apparatus includes a main body, a fusing unit mounted in the main body to fuse an image to paper, a cover mounted to the main body to expose the fusing unit, a heat shielding member mounted proximate to an inner side of the cover to block heat transferred from the fusing unit, an external air circulation chamber formed between the heat shielding member and the cover, in which external air circulates by convection, and at least one external air flow hole, through which the air flows into/out of the external air circulation chamber.

Abstract: An image forming apparatus capable of minimizing a temperature rise of a cover by substantially preventing heat emission from a fusing device to an outside is disclosed. The image forming apparatus includes a main body, a fusing device mounted in the main body, the fusing device having an outlet to discharge paper, an opening/closing member opening and closing the outlet of the fusing device, a cam member moving the opening/closing member between a first position in which the opening/closing member closes the outlet to prevent heat in the fusing device from being emitted through the outlet and a second position in which the opening/closing member opens the outlet to permit the paper to pass through the outlet, a driving part rotating the cam member, and a control unit controlling the driving part to determine a rotational position of the cam member.

Abstract: An image forming apparatus capable of minimizing a temperature rise of a cover by substantially preventing heat emission from a fusing device to an outside is disclosed. The image forming apparatus includes a main body, a fusing device mounted in the main body, the fusing device having an outlet to discharge paper, an opening/closing member opening and closing the outlet of the fusing device, a cam member moving the opening/closing member between a first position in which the opening/closing member closes the outlet to prevent heat in the fusing device from being emitted through the outlet and a second position in which the opening/closing member opens the outlet to permit the paper to pass through the outlet, a driving part rotating the cam member, and a control unit controlling the driving part to determine a rotational position of the cam member.

Abstract: An image forming apparatus capable of minimizing a temperature rise of a cover is disclosed. The image forming apparatus includes a main body, a fusing unit mounted in the main body to fuse an image to paper, a cover mounted to the main body to expose the fusing unit, a heat shielding member mounted proximate to an inner side of the cover to block heat transferred from the fusing unit, an external air circulation chamber formed between the heat shielding member and the cover, in which external air circulates by convection, and at least one external air flow hole, through which the air flows into/out of the external air circulation chamber.

Abstract: An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.

Abstract: An inspecting apparatus for semiconductor devices including: a match plate; a contact module combined with the match plate, and the match plate including a radiation unit radiating heat from the semiconductor devices to the outside, and a test unit contacting leads of the semiconductor; an insert module installed on a bottom of the contact module, and having a semiconductor device accommodator to accommodate the semiconductor device; and an auxiliary radiation member installed on a bottom of the insert module, and radiating the heat from the semiconductor device to the outside. Accordingly, the inspecting apparatus for semiconductor device according to the present invention performs testing at a constant temperature regardless of heat from the semiconductors by radiating the heat from the semiconductors immediately and efficiently, thereby producing more accurate test results.

Abstract: An inspecting apparatus for a semiconductor device includes a match plate; a contact module combined with the match plate and including a radiator to radiate heat from the semiconductor device to the outside and a tester to contact the leads of the semiconductor device; and a heat pipe provided in the radiator. The inspecting apparatus performs testing at a constant temperature, regardless of heat from the semiconductor device, by transferring the heat quickly and efficiently, thereby producing more accurate test results. The apparatus also improves productivity and saves expense by removing faulty test results caused by incorrectly identifying a qualified semiconductor device as a defective semiconductor device.

Abstract: A semiconductor device test apparatus includes a main body and a stacker for stacking devices before and after a test. The stacker includes at least one user tray feeder predesignated with a function for stacking un-tested devices and at least one user tray sender predesignated with a function for stacking tested devices, the user tray functions being interchangeable during stacker operation.

Abstract: An inspecting apparatus for semiconductor devices including: a match plate; a contact module combined with the match plate, and the match plate including a radiation unit radiating heat from the semiconductor devices to the outside, and a test unit contacting leads of the semiconductor; an insert module installed on a bottom of the contact module, and having a semiconductor device accommodator to accommodate the semiconductor device; and an auxiliary radiation member installed on a bottom of the insert module, and radiating the heat from the semiconductor device to the outside. Accordingly, the inspecting apparatus for semiconductor device according to the present invention performs testing at a constant temperature regardless of heat from the semiconductors by radiating the heat from the semiconductors immediately and efficiently, thereby producing more accurate test results.

Abstract: An inspecting apparatus for semiconductor devices comprising: a match plate; a contact module combined with the match plate, itself comprising a radiator to radiate heat from the semiconductor device to the outside and a tester to contact the leads of the semiconductor device; and a heat pipe provided in the radiator. Accordingly, the inspecting apparatus for semiconductor devices according to the present invention performs testing at a constant temperature, regardless of heat from the semiconductor device, by transferring heat from the semiconductor device quickly and efficiently, thereby producing more accurate test results.

Abstract: An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.