Patents by Inventor Je-suk Lee
Je-suk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134102Abstract: A polarization film according to an embodiment includes a first wavelength dispersion layer, and a polarization layer that is disposed on the first wavelength dispersion layer. A wavelength dispersion of the first wavelength dispersion layer satisfies both Relational Expression 1 and Relational Expression 2: [Relational Expression 1] 0.81<DSP 450 nm=R 450 nm/R 550 nm<0.83 [Relational Expression 2] 1.15<DSP 650 nm=R 650 nm/R 550 nm<1.17. In Relational Expression 1 and Relational Expression 2, R(?) denotes a phase difference value in wavelength ?.Type: ApplicationFiled: October 4, 2023Publication date: April 25, 2024Applicant: Samsung Display Co., LTD.Inventors: Duk Jin LEE, Beong-Hun BEON, Je Seon YEON, Woo Suk JUNG
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Patent number: 11958897Abstract: The present invention relates to an anti-VAMP2 antibody that inhibits SNARE complex and uses thereof, and more specifically, the present invention relates to an anti-VAMP2 antibody or antigen-binding fragments thereof comprising heavy and light chain CDRs of a specific sequence. The anti-VAMP2 antibody is expected to be useful for improving or treating skin wrinkles by inhibiting SNARE complex formation.Type: GrantFiled: August 14, 2019Date of Patent: April 16, 2024Assignee: HAUUL BIOInventors: Hee-Jun Na, Yun-Suk Lee, Je-Ok Yoo, Kwang-Soon Lee, Kang Seung Lee, Seung Je Min
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Publication number: 20240118473Abstract: A display device includes: a display panel and an optical member positioned on the display panel. The optical member includes: a polarization layer positioned on the display panel; a first compensation layer positioned between the display panel and the polarization layer; a second compensation layer positioned between the display panel and the first compensation layer; a third compensation layer positioned between the display panel and the second compensation layer; and a fourth compensation layer positioned between the display panel and the third compensation layer. The first compensation layer is a positive C plate and a thickness direction phase delay value of the first compensation layer is about ?65 nm to about ?15 nm, and the second compensation layer is a positive A plate and an in-plane phase delay value of the second compensation layer is about 75 nm to about 125 nm.Type: ApplicationFiled: July 31, 2023Publication date: April 11, 2024Inventors: Beong-Hun BEON, Je Seon YEON, Duk Jin LEE, Woo Suk JUNG
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Patent number: 11939308Abstract: The present disclosure provides a novel biphenyl derivative compound or a pharmaceutically acceptable salt thereof. The biphenyl derivative compound or pharmaceutically acceptable salt thereof according to the present disclosure is a compound that increases Nm23-H1/NDPK activity and can inhibit cancer metastasis and growth. Thus, it exhibits excellent effects not only on the prevention, alleviation and treatment of cancer, but also on the suppression of cancer metastasis.Type: GrantFiled: May 30, 2019Date of Patent: March 26, 2024Assignee: EWHA University—Industry Collaboration FoundationInventors: Kong Joo Lee, Hee-Yoon Lee, Je Jin Lee, Hwang Suk Kim, Ji-Wan Seo, Hongsoo Lee, Ji Soo Shin, Bo-kyung Kim
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Publication number: 20230336890Abstract: An image sensing system includes a camera module and an application processor. The camera module includes: an image sensor including a pixel array, the pixel array including color filters having a first pattern, the image sensor being configured to sense light incident on the pixel array to generate a first pattern image signal having the first pattern; a first converter configured to convert the first pattern image signal into a second pattern image signal having a second pattern different from the first pattern; and a second converter configured to convert the second pattern image signal into a third pattern image signal having a third pattern different from the first pattern and the second pattern. The application processor is configured to perform image processing on the third pattern image signal.Type: ApplicationFiled: June 26, 2023Publication date: October 19, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jang Ho MOON, Deok Ha Shin, Je Suk Lee, Hee Geun Park, So Young Jeong
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Patent number: 11729532Abstract: An image sensing system includes a camera module and an application processor. The camera module includes: an image sensor including a pixel array, the pixel array including color filters having a first pattern, the image sensor being configured to sense light incident on the pixel array to generate a first pattern image signal having the first pattern; a first converter configured to convert the first pattern image signal into a second pattern image signal having a second pattern different from the first pattern; and a second converter configured to convert the second pattern image signal into a third pattern image signal having a third pattern different from the first pattern and the second pattern. The application processor is configured to perform image processing on the third pattern image signal.Type: GrantFiled: September 15, 2021Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jang Ho Moon, Deok Ha Shin, Je Suk Lee, Hee Geun Park, So Young Jeong
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Publication number: 20220086381Abstract: An image sensing system includes a camera module and an application processor. The camera module includes: an image sensor including a pixel array, the pixel array including color filters having a first pattern, the image sensor being configured to sense light incident on the pixel array to generate a first pattern image signal having the first pattern; a first converter configured to convert the first pattern image signal into a second pattern image signal having a second pattern different from the first pattern; and a second converter configured to convert the second pattern image signal into a third pattern image signal having a third pattern different from the first pattern and the second pattern. The application processor is configured to perform image processing on the third pattern image signal.Type: ApplicationFiled: September 15, 2021Publication date: March 17, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jang Ho MOON, Deok Ha Shin, Je Suk Lee, Hee Geun Park, So Young Jeong
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Patent number: 11044407Abstract: An image sensor may include a pixel array having an N×M array of merged pixels arranged in a Bayer pattern, each merged pixel including an k*l matrix of unit pixels of a same color, where k and l are integers greater than two; and an image signal processor to process signals output by the pixel array in accordance with a normal mode or a zoom-in mode. In the zoom-in mode, signals from the pixel array may be remosaiced such that signals corresponding to the unit pixels are arranged in a p*q matrix of unit pixels of a same color, wherein p is a non-negative integer that is less than k and q is a non-negative integer less than 1, the p*q matrixes being arranged in a Bayer pattern.Type: GrantFiled: March 20, 2019Date of Patent: June 22, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Il Yun Jeong, Je Suk Lee
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Publication number: 20200077026Abstract: An image sensor may include a pixel array having an N×M array of merged pixels arranged in a Bayer pattern, each merged pixel including an k*l matrix of unit pixels of a same color, where k and l are integers greater than two; and an image signal processor to process signals output by the pixel array in accordance with a normal mode or a zoom-in mode. In the zoom-in mode, signals from the pixel array may be remosaiced such that signals corresponding to the unit pixels are arranged in a p*q matrix of unit pixels of a same color, wherein p is a non-negative integer that is less than k and q is a non-negative integer less than 1, the p*q matrixes being arranged in a Bayer pattern.Type: ApplicationFiled: March 20, 2019Publication date: March 5, 2020Inventors: Il Yun JEONG, Je Suk LEE
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Patent number: 10257426Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.Type: GrantFiled: January 13, 2016Date of Patent: April 9, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
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Publication number: 20160198095Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.Type: ApplicationFiled: January 13, 2016Publication date: July 7, 2016Inventors: Yun Tae LEE, Joon Seo YIM, Je Suk LEE, Jae Yong PARK, Jun-Woo PARK, Su-Young LEE
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Patent number: 9257467Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.Type: GrantFiled: November 29, 2010Date of Patent: February 9, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
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Publication number: 20110141318Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.Type: ApplicationFiled: November 29, 2010Publication date: June 16, 2011Inventors: Yun Tae Lee, Joon Seo Yim, Je Suk Lee, Jae Yong Park, Jun-Woo Park, Su-Young Lee
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Publication number: 20070019093Abstract: A high-speed image pickup method and controller of an image pickup device are provided.Type: ApplicationFiled: September 15, 2006Publication date: January 25, 2007Inventors: Je-suk Lee, Si-young Chin
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Patent number: 7129977Abstract: A high-speed image pickup method and controller of an image pickup device are provided.Type: GrantFiled: November 2, 2001Date of Patent: October 31, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Je-suk Lee, Si-Young Chin
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Patent number: 6573934Abstract: Digital correction of non-linearity using a piecewise linear approximation method generates uniform errors of minimal magnitude regardless of the size of an input signal. The non-linear curve is partitioned into a number of sections which are increased over conventional techniques, without increasing the number of function values, or the amount of hardware required. A non-linear curve is divided into a first direct line and a second direct line using a piecewise linear approximation method. A third direct line links two points spaced to either side of an inflection point at the intersection of the first and second direct lines by a predetermined distance. The slope of the third direct line corresponds to the average of the slopes of the first and second direct lines. When an input x lies in the section of the third direct line, a corrected signal according to the third direct line is generated.Type: GrantFiled: December 3, 1998Date of Patent: June 3, 2003Assignee: Samsung Electronics Co., Ltd.Inventor: Je-suk Lee
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Publication number: 20020135691Abstract: A high-speed image pickup method and controller of an image pickup device are provided.Type: ApplicationFiled: November 2, 2001Publication date: September 26, 2002Applicant: Samsung Electronics Co., Ltd.Inventors: Je-suk Lee, Si-Young Chin
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Patent number: 5764308Abstract: A method of adjusting hue in color video signals partitions the region of all available hues into subregions in accordance with the signs of U and V components of input color video signals, which U and V signals are respectively proportional to blue-minus-luminance and red-minus luminance color-difference signals. The hue in each subregion is adjusted independently of the hues in the other subregions. Within each subregion, each of the U and V components of the input color video signals that fall therein is gain-adjusted by prescribed factors according to the subregion. A hue adjustment device determines from the signs U and V components of input color video signals which of the subregions they fall into, and adjusts the hue in each subregion to facilitate more accurate hue adjustment.Type: GrantFiled: June 14, 1996Date of Patent: June 9, 1998Assignee: Samsung Electronics Co., Ltd.Inventor: Je-suk Lee