Abstract: Disclosed are a vehicle including an electric motor and a method of controlling the same for providing a notification function to an occupant of the vehicle by controlling a pitching motion of a vehicle body. The method includes calculating a first torque value for providing the pitching motion based on driving state information including a vehicle speed, a driving mode, and an environment of a driving road; calculating a second torque value based on a request of a driver; and calculating a final torque value for controlling the electric motor based on the first torque value and the second torque value.

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Abstract: The present disclosure relates to a photo-curable composition, a cured product thereof, and an optical member and a display device comprising same. The photo-curable composition has excellent low refractive index, light transmittance, and low haze characteristics by comprising a first olefinic monomer containing fluorine, a second olefinic monomer having an absolute viscosity of 7 cP or less at 25° C., a photo-polymerization initiator, and an amine compound.

Abstract: A coil component includes a body including a first surface and a second surface opposing each other, and a first side surface and a second side surface opposing each other and connecting the first surface of the body to the second surface of the body; a support substrate embedded in the body and including a first surface and a second surface opposing each other; coil portion disposed on the support substrate; and a recognition pattern disposed on the first surface of the body, wherein the recognition pattern extends, from an edge region in which the first surface of the body is in contact with the first side surface of the body, toward an edge region in which the first surface of the body is in contact with the second side surface of the body.

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Abstract: A coil component includes a body including a first surface and a second surface opposing each other, and a first side surface and a second side surface opposing each other and connecting the first surface of the body to the second surface of the body; a support substrate embedded in the body and including a first surface and a second surface opposing each other; coil portion disposed on the support substrate; and a recognition pattern disposed on the first surface of the body, wherein the recognition pattern extends, from an edge region in which the first surface of the body is in contact with the first side surface of the body, toward an edge region in which the first surface of the body is in contact with the second side surface of the body.

Abstract: A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.

Abstract: A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.

Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

Abstract: There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; a first input terminal; an output terminal; and a ground terminal.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03?Tb/T?0.25 is satisfied.

Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

Abstract: A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.