Patents by Inventor Jea-Ju Chu

Jea-Ju Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130200038
    Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical de
    Type: Application
    Filed: September 6, 2011
    Publication date: August 8, 2013
    Applicant: BASF SE
    Inventors: Yuzhuo Li, Jea-Ju Chu, Shyam Sundar Venkataraman, Sheik Ansar Usman Ibrahim, Harvey Wayne Pinder
  • Publication number: 20130168348
    Abstract: An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.
    Type: Application
    Filed: September 5, 2011
    Publication date: July 4, 2013
    Applicant: BASF SE
    Inventors: Yuzhuo Li, Jea-Ju Chu, Shyam Sundar Venkataraman, Wei Lan William Chiu, Harvey Wayne Pinder
  • Publication number: 20130161285
    Abstract: An aqueous polishing composition comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) water-soluble and water-dispersible hydroxy group containing components selected from (b1) aliphatic and cycloaliphatic hydroxycarboxylic acids, wherein the molar ratio of hydroxy groups to carboxylic acid groups is at least 1; (b2) esters and lactones of the hydroxycarboxylic acids (b1) having at least one hydroxy group; and (b3) mixtures thereof; and (C) water-soluble and water-dispersible polymer components selected from (c1) linear and branched alkylene oxide polymers; (c2) linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) polymers; and (c3) cationic polymeric flocculents having a weight average molecular weight of less than 100,000 Dalton.; and a process for polishing substrate materials for electrical, mechanical and optical devices.
    Type: Application
    Filed: September 6, 2011
    Publication date: June 27, 2013
    Applicant: BASF SE
    Inventors: Yuzhuo Li, Jea-Ju Chu, Shyam Sundar Venkataraman, Sheik Ansar Usman Ibrahim, Harvey Wayne Pinder
  • Publication number: 20080207091
    Abstract: The invention provides a slurry composition for polishing color filters. The slurry composition at least includes an abrasive, a buffer solution and an additive. The abrasive is selected from the group consisting of alumina, ceria, magnesia, silica, titania, zirconia, cupric oxide, ferric oxide, zinc oxide and the mixture thereof. The buffer solution is used for adjusting pH to a desired range. The additive is used for stabilizing the polishing composition and also improving the polishing performance.
    Type: Application
    Filed: June 12, 2006
    Publication date: August 28, 2008
    Inventors: Yu-Lung Jeng, Jea-Ju Chu, Chang-Tai Lee, Karl Hensen