Patents by Inventor Jea Yi

Jea Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996369
    Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: May 28, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
  • Publication number: 20050235972
    Abstract: An EGR system has an EGR distributor in the form of a single plate integrally equipped with an exhaust gas passage and a coolant passage for recirculated exhaust gas therewith. The lengths of each exhaust gas passages for the recirculated exhaust gas to reach each cylinder are equal to each other, whereby the amount of the exhaust gas recirculated to each intake passage is same and the overall efficiency of the EGR system is improved. The EGR distributor is preferably manufactured in the form of a single component by AL die casting method.
    Type: Application
    Filed: December 10, 2004
    Publication date: October 27, 2005
    Inventor: Jea Yi