Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium.

Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium.

Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium.

Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with gold.

Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium.

Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with gold.

Abstract: An embodiment of a method for manufacturing an optical ring resonator device is disclosed. The method forms a ring resonator waveguide on a semiconductor substrate, forms an unoriented electro-optic polymer cladding over the ring resonator waveguide, and forms electrodes on the semiconductor substrate. The unoriented electro-optic polymer cladding is configured to change orientation under an applied electric field, and the electrodes are coupled to the optical ring resonator for manipulation of the electric field applied to the oriented electro-optic polymer cladding for rapid voltage tuning of its index.

Abstract: An embodiment of a method for manufacturing an optical ring resonator device is disclosed. The method forms a ring resonator waveguide on a semiconductor substrate, forms an unoriented electro-optic polymer cladding over the ring resonator waveguide, and forms electrodes on the semiconductor substrate. The unoriented electro-optic polymer cladding is configured to change orientation under an applied electric field, and the electrodes are coupled to the optical ring resonator for manipulation of the electric field applied to the oriented electro-optic polymer cladding for rapid voltage tuning of its index.

Abstract: A capsule for cosmetic and/or dermatological ingredients and processes for the production thereof. The capsule comprises an envelope which is solid, semisolid and/or dimensionally stable and comprises one or more substances which are selected from waxes, emulsifiers, and natural and synthetic polymers. The capsule may also comprise a filling.

Abstract: The present invention is directed to systems and methods for radiating radar signals, communication signals, or other similar signals. In one embodiment, a system includes a controller that generates a control signal and an antenna coupled to the controller. The antenna includes a first component that generates at least one wave based on the generated control signal and a metamaterial lens positioned at some predefined focal length from the first component. The metamaterial lens directs the generated at least one wave.

Abstract: The present invention is directed to systems and methods for radiating radar signals, communication signals, or other similar signals. In one embodiment, a system includes a controller that generates a control signal and an antenna coupled to the controller. The antenna includes a first component that generates at least one wave based on the generated control signal and a metamaterial lens positioned at some predefined focal length from the first component. The metamaterial lens directs the generated at least one wave.

Abstract: The plasma descaling process of the present invention removes surface oxides selectively from structural metal surfaces, especially titanium and its alloys, and, with appropriate control of the reaction temperature, is self-limiting to avoid cracking problems otherwise associated with intergranular attack. In a preferred embodiment of the present invention, a fluoride plasma reacts with surface oxides on a titanium alloy to remove scale and alpha case in a temperature controlled chamber without attacking the underlying crystalline metal to cause intergranular attack. Properly controlled by regulating the chamber temperature, the plasma reaction terminates when the plasma has removed the surface oxides and encounters the underlying crystalline metal. The product is a metal surface free of scale and alpha case and free of intergranular attack. The plasma descaling process replaces conventional metal finishing processes, such as chemical milling or etching.

Abstract: A method for manufacturing a multichip module deposited substrate board utilizing alternating layers of high density thin-film metal and either preimidized or non-preimidized organic polymer insulating material wherein the insulating material is cured during manufacture using either ultraviolet radiation, ion beam radiation or electron beam radiation. This method eliminates subjecting the in-process substrate board to temperatures in excess of the recrystalization temperature of the thin-film metal, thereby eliminating the source of warpage and metal interdiffusion and corrosion at the metal to insulating material interface. This process enables successful manufacture of large format multichip module deposited substrate boards in sizes up to approximately 24 inches square.

Abstract: The invention provides a method of removing surface scale from a titanium or titanium alloy substrate. The method includes the steps of heating the substrate to a temperature in the range from about 100.degree. C. to about 600.degree. C., and thereafter subjecting the heated surface to a plasma formed from a gas selected from the group of consisting of CF.sub.4 and SF.sub.6. The plasma reacts with the surface scale, removing the scale, without attacking the underlying crystalline titanium or titanium alloy. Properly controlled, the plasma reaction terminates when the plasma has penetrated the scale and encounters the underlying crystalline metal. As a result, the method of the invention is capable of uniform removal of the entire surface scale of a crystalline titanium-containing substrate, without intergranular attack of the substrate.

Abstract: The invention provides a method of removing surface scale from a titanium or titanium alloy substrate. The method includes the steps of heating the substrate to a temperature in the range from about 100.degree. C. to about 600.degree. C., and thereafter subjecting the heated surface to a plasma formed from a gas selected from the group of consisting of CF.sub.4 and SF.sub.6. The plasma reacts with the surface scale, removing the scale, without attacking the underlying crystalline titanium or titanium alloy. Properly controlled, the plasma reaction terminates when the plasma has penetrated the scale, and encounters the underlying crystalline metal. As a result, the method of the invention is capable of uniform removal of the entire surface scale of a crystalline titanium-containing substrate, without intergranular attack of the substrate.