Abstract: The measuring apparatus (10) according to the invention includes a hot source (14) and a cold source (18), each provided with a thermocouple (21, 22) and connected via a solid bar (17) of copper that is in contact with the hot source and is spaced apart from the cold source by a regulatable distance (19). The measuring method is based on calculating the thermal resistance R=(T1-T2)/Q, where T1-T2 and Q are, respectively, the temperature difference and the thermal flux between the sources. R1 is calculated with the element (11), then R2 is calculated without the element (11). The difference R1-R2 gives the thermal resistance of the element.

Abstract: The ventilation device (10) for components (11) disposed in rows (R1-R4) separated by corridors (C1-C5) on one face of a substrate (12) includes an inlet conduit (14) for fresh air and an outlet conduit (15) comprising two compartments (15a; 15b) each covering two rows (R1, R2; R3, R4) of components (11) and having an opening (18a; 19b) discharging into the corridor (C2; C4) separating the respective rows. The fresh air at the inlet (16) of the conduit (14) discharges into the other corridors (C1, C3, C4) such that each component (11) receives the fresh air directly. The invention thus has the advantage of effectively cooling a great number of high-power components mounted at high density on a printed circuit board, because of its simple, compact structure, which enables ventilation with less noise and with high output.

Abstract: The invention relates to apparatus for clamping superimposed conductive elements (11, 13) disposed in aligned groups by means of a clip device (22, 23) such that an integrated circuit device may be removably connected to a printed circuit card with a predetermined force being applied uniformly across all the superimposed elements. In accordance with the invention, at least one of the clips (22, 23), in the free state, has a cambered form, equivalent to the elastic deformation of an initially straight beam of uniform section and of the same length mounted on two simple supports spaced this length and uniformly charged over this length.The invention is primarily used for the electrical interconnection of integrated circuit devices to printed circuit cards.

Abstract: The invention provides an electrical connection device for connecting high density contacts of large scale integrated circuits (LSI) and serves to establish electrical connection between the contact areas (15) of the circuit network (14) on a substrate (11) for supporting integrated circuit devices (12) and the contact pads (18) of a conductor network (17) on a printed circuit card (13). The electric connection device comprises a plurality of conductive elements disposed within a housing (26) extending in a given direction. The conductive elements are electrically insulated one from the other and have contacts which are exposed through slots in the housing to connect to the areas (15) and pads (18). The conductive elements (29) are stacked in the given direction and are formed each with a conductor sheet (30) provided with two contact surfaces (31a, 32a) elastically movable in a plane normal to the given direction independently of the surfaces of contact of neighboring sheets.