Abstract: A vertical-cavity surface-emitting laser component operating at a wavelength lying in the range 1.3 .mu.m to 1.55 .mu.m, the component comprising a layer of active material having an injection zone of width that is smaller than the width of the component, said zone emitting radiation when an electrical current is injected therein, the component also comprising an amplifying medium for amplifying the radiation and two mirrors that are reflective at the emission wavelength and disposed respectively above and below the amplifying medium. The amplifying medium includes a circular barrier extending facing the active material, said barrier opposing the passage of current and defining a current-passing channel in its center facing the injection zone, said channel being of a width that is smaller than the width of the injection zone.

Abstract: A distributed feedback semiconductor laser comprising a substrate and, on such substrate, a double heterostructure formed by a confinement layer, an active layer, a guiding layer engraved to form a diffraction network, the active layer and the guiding layer being engraved to form a ribbon having a certain width and a certain thickness and a central portion of larger width and thickness, a metal electrode surmounting the assembly and enabling charges to be injected through the ribbon, wherein the metal electrode comprises two distinct portions forming a first electrode disposed above the central widened or thickened portion of the ribbon, the first electrode being connected to a first connection for the injection of a first current and a second electrode disposed above the rest of the ribbon and connected to a second connection for the injection of a second current.

Abstract: For burying the active strip, two narrow bands are etched on either side of the strip and localized epitaxy repeat takes place on said two bands, which makes it possible to work at lower temperatures. Moreover, the substrate and confinement layer are of type p and the epitaxy repeat layer of highly doped type n.sup.+. The guide layer can be etched to constitute a defractive network.

Abstract: Process for producing a laser having several wavelengths, wherein:a first double heterostructure is produced by epitaxy with an active layer having a first composition,the first double heterostructure obtained is etched into the substrate, through a mask having openings in the form of strips, which leads to a substrate on which there are strips of the first double heterostructure separated by etched portions,a second double heterostructure with an active layer having a second composition is grown in the etched portions,a groove is formed between the first and second heterostructures down to the contact layer, andthe groove undergoes proton bombardment.The invention also relates to the laser obtained by this process.Application to optical telecommunications.

Abstract: A light source with a semiconductor junction having a substrate on which are successively deposited a first and second semiconductor layer having opposite doping and means for injecting charge carriers from a power supply, wheein the means includes a highly doped contact layer partly covered by an alloyed metal layer forming an ohmic contact and a metal layer covering the alloyed layer, together with the remainder of the second semiconductor layer, with the metal layer being connected to the power supply and wherein the semiconductor constituting the second layer is chosen from among those which form a Schottky diode in contact with a metal like that of the metal layer. The diode is reverse polarized under the normal operating conditions of the source with the zone in which charge injection takes place consequently being limited to a single ohmic contact zone, excluding the zones in which there is a Schottky diode.

Abstract: Process for producing an injection laser and laser obtained by this process. The active layer is weakly n doped. The same mesa is used for carrying out a proton implantation and a zinc diffusion. The active stripe is transversely limited by two homojunctions and two index jumps and the final structure is planar. In addition, there is an auto-alignment of the implanted and diffused zones.Application to the construction of lasers used in optical telecommunication systems.

Abstract: The present invention relates to the connection of insulated electric wires, and it pertains more precisely to a terminal and a connection block for electrically connecting two insulated wires without prestripping them. Prior art connecting devices that operate without prestripping are usually in the form of a flat spring, cut in a U shape, the branches of which define a slot. In such devices, the insulated wire to be connected is introduced at the end of the slot adjacent the free ends of the branches. This type of device has a disadvantage since the perforation of the insulation is made where the deformation of the branches is the easiest. The self-stripping connecting device of the present invention is constituted by a flat spring including a portion forming a U, the branches of which are elastically biased one against the other, and an opening to allow the introduction of the insulated wire at the end of the slot adjacent the base of the U.

Abstract: A connector having a resilient contact that makes a rolling contact with the conductor pads of a printed circuit board instead of a wiping contact therewith. According to the invention, a resilient contact has a first portion which is initially in the path of a board to be inserted in the connector and is displaced along the path as the card is inserted. A second portion of the resilient contact has a bulge which follows in the direction of movement of the first portion, but applies a continually increasing lateral force against the conductor pad as the board continues to be inserted. The invention also includes a latching device for latching the circuit board securely in the connector body.

Abstract: A method and apparatus for soldering terminals to printed circuit boards, and particularly for soldering terminals simultaneously to both sides of a printed circuit board. The apparatus consists of a connected series of preformed cones of solder which are positioned above holes in the circuit board, and through which terminals to be heated are inserted. The solder flows through the hole by capillary action, and provides electrical connection between the terminal and conduction paths on both sides of the circuit board.

Abstract: An improved socket for blade-type electrical contacts which is simple to manufacture, has a high degree of electrical contact reliability and mechanical retention strength, and yet is small in comparison with prior art sockets. The socket is preferably affixed to a printed circuit board, either directly or by means by an intermediate mounting plate for receiving the contact pins of a standard DIP circuit element. In the printed circuit board or intermediate mounting plate, bores are provided in which the contact sockets are inserted. The sockets are prevented from rotation within the bore by crimping the socket and soldering it to the conductor side of the printed circuit board. Each contact socket has an entry end for receiving a blade-type contact pin and an opposite end remote from the entry end.