Patents by Inventor Jean de Dieu Muntangana

Jean de Dieu Muntangana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Communication Jack Having a Dielectric Film Between Plug Interface Contacts
    Publication number: 20220059971
    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
    Type: Application
    Filed: November 2, 2021
    Publication date: February 24, 2022
    Applicant: Panduit Corp.
    Inventors: Satish I. Patel, Roman J. Churnovic, Jean de Dieu Muntangana
  • Communication jack having a dielectric film between plug interface contacts
    Patent number: 11165202
    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: November 2, 2021
    Assignee: Panduit Corp.
    Inventors: Satish I. Patel, Roman J. Churnovic, Jean de Dieu Muntangana
  • Communication Jack Having a Dielectric Film Between Plug Interface Contacts
    Publication number: 20200144770
    Abstract: Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 7, 2020
    Applicant: Panduit Corp.
    Inventors: Satish I. Patel, Roman J. Churnovic, Jean de Dieu Muntangana