Patents by Inventor Jean-François Sauty

Jean-François Sauty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of forming
    Patent number: 8786084
    Abstract: A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a bond-wire of a first metallic composition, the bond-wire and the bond-pad being coated with a protection layer of a second metallic composition.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: July 22, 2014
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Romain Coffy, Jean-François Sauty
  • SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY
    Publication number: 20120020039
    Abstract: A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.
    Type: Application
    Filed: June 17, 2011
    Publication date: January 26, 2012
    Applicant: STMICROELECTRONICS (GRENOBLE) SAS
    Inventors: Romain Coffy, Jean-François Sauty
  • SEMICONDUCTOR PACKAGE
    Publication number: 20100244249
    Abstract: A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a wire-bond of a first metallic composition, the wire-bond and the bond-pad being coated with a protection layer of a second metallic composition.
    Type: Application
    Filed: March 31, 2010
    Publication date: September 30, 2010
    Applicant: STMicroelectronics (Grenoble) SAS
    Inventors: Romain Coffy, Jean-François Sauty