Abstract: Methods and apparatus for non-destructive inspection using microwave microscopy are disclosed. In one embodiment, a method for inspecting an electrically-conductive mesh in a composite component using microwave microscopy comprises generating radio-frequency electromagnetic radiation using a microwave microscopy probe disposed adjacent the composite component so that the radio-frequency electromagnetic radiation interacts with the electrically-conductive mesh in the composite component, and, detecting a characteristic associated with the microwave microscopy probe. The detected characteristic is indicative of a condition of the electrically-conductive mesh.

Abstract: Methods and apparatus for non-destructive inspection using microwave microscopy are disclosed. In one embodiment, a method for inspecting an electrically-conductive mesh in a composite component using microwave microscopy comprises generating radio-frequency electromagnetic radiation using a microwave microscopy probe disposed adjacent the composite component so that the radio-frequency electromagnetic radiation interacts with the electrically-conductive mesh in the composite component, and, detecting a characteristic associated with the microwave microscopy probe. The detected characteristic is indicative of a condition of the electrically-conductive mesh.

Abstract: In a method of data transmission according to one embodiment of the invention, data transitions on adjacent conductors are separated in time. In a method of data transmission according to another embodiment of the invention, signals on adjacent conductive paths pass through different alternating sequences of inversions and regenerations. In a method of data transmission according to a further embodiment of the invention, data transitions having the same clock dependence are separated in space.

Abstract: In a method of data transmission according to one embodiment of the invention, data transitions having the same clock dependence are separated in space. In one such method, signals of one set are transmitted on corresponding conductive paths in one direction, signals of another set are transmitted on corresponding conductive paths in the other direction, and adjacent conductive paths that each carry a signal of one set are separated by at least one conductive path that carries a signal of another set. In an apparatus according to one embodiment of the invention, the conductive paths are fabricated on a semiconductor substrate.

Abstract: In a method of data transmission according to one embodiment of the invention, data transitions on adjacent conductors are separated in time. In a method of data transmission according to another embodiment of the invention, signals on adjacent conductive paths pass through different alternating sequences of inversions and regenerations. In a method of data transmission according to a further embodiment of the invention, data transitions having the same clock dependence are separated in space.

Abstract: In a method of data transmission according to one embodiment of the invention, data transitions having the same clock dependence are separated in space. In one such method, signals of one set are transmitted on corresponding conductive paths in one direction, signals of another set are transmitted on corresponding conductive paths in the other direction, and adjacent conductive paths that each carry a signal of one set are separated by at least one conductive path that carries a signal of another set. In an apparatus according to one embodiment of the invention, the conductive paths are fabricated on a semiconductor substrate.

Abstract: In a method of data transmission according to one embodiment of the invention, data transitions on adjacent conductors are separated in time. In one such method, a plurality of sets of input signals is received, and a plurality of sets of corresponding output signals is transmitted. One set of the output signals is delayed with respect to another set by a delay period T_DLY. In another such method, the output signals are transmitted and received on the same semiconductor substrate.