Abstract: A skate (e.g., an ice skate) or other footwear for a user. The skate or other footwear comprises a skate boot or other foot-receiving structure for receiving a foot of the user and possibly one or more other components, such as a skating device (e.g., a blade 5 and a blade holder) disposed beneath the skate boot to engage a skating surface (e.g., ice). In some cases, at least part of the skate boot or other foot-receiving structure and optionally at least part of one or more other components (e.g., the skating device) may be constructed from one or more materials (e.g., foams) molded by flowing in molding equipment during a molding process (e.g., injection molding or 0 casting). This may allow the skate or other footwear to have useful performance characteristics (e.g., reduced weight, proper fit and comfort, etc.) while being more cost-effectively manufactured.

Abstract: A 3D printed thermal expansion structure includes a thermoplastic material and a thermal expansion material, wherein the thermoplastic material is in a range from 50 to 90 wt % based on a weight of the 3D printed thermal expansion structure, and the thermal expansion material is in a range from 10 to 50 wt % based on the weight of the 3D printed thermal expansion structure. The thermoplastic material and the thermal expansion material are mixed to form a mixed material, and the mixed material is utilized by a 3D printing apparatus to form a solid object, and the solid object is heated to form the 3D printed thermal expansion structure. A manufacturing method of a 3D printed thermal expansion structure is provided herein.

Abstract: A device (e.g., an article of athletic gear) comprising a post-molded expandable component, which is a part of the device that is configured to be expanded or has been expanded after being molded. This may allow the post-molded expandable component to have enhanced characteristics (e.g., be more shock-absorbent, lighter, etc.), to be cost-effectively manufactured (e.g., by using less material and/or making it in various sizes), and/or to be customized for a user (e.g., by custom-fitting it to the user).

Abstract: Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Abstract: Chip pairs in a semiconductor module have a spacing between them that forms a spacing region. A lid has a lid bottom side and one or more feet. The feet protrude from a periphery of the lid bottom side. A sealband adhesive has a sealband adhesive thickness and adheres the feet to a substrate so the chip pairs are under the lid bottom side and back sides of the chips are in thermal contact with the lid bottom side. A variable thickness lid adhesive connects the substrate in the spacing region to the lid bottom side. The variable thickness lid adhesive has a lid adhesive thickness that is greater than the sealband adhesive thickness by a delta thickness amount. In some embodiments, the lid also has a shortened central lid rib with a bottom. The shorten central lid rib protrudes an extension distance from the lid bottom side into the spacing region. In these embodiments, the variable thickness lid adhesive connects the substrate in the spacing region to the bottom.

Abstract: An integrated circuit (IC) module includes a carrier and multiple IC devices. A heterogenous seal band connects a lid to the carrier. A perimeter wall of the lid is joined to a low modulus seal band and an inner wall of the lid is joined to a high modulus seal band. The low modulus seal band is located around the perimeter of the lid and a perimeter of the multiple IC devices. The high modulus seal band is located between the multiple IC devices. The low modulus seal band has a low resistance to being deformed elastically and the high modulus seal band has a high resistance to being deformed elastically. The low modulus seal band allows for dimensional fluctuations between the lid and carrier. The high modulus seal band allows for adequate joining of the lid and the carrier with relatively less seal band material.

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements.

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements.

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements.

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements.

Abstract: Various embodiments relate to an apparatus and method for squelching and unsquelching serial port ingress traffic, including a squelch timer, an idle timer and a state machine which is configured to enable squelch and enable a data path, load and start the squelch timer when a character is received by the serial port, load and start the idle timer, activate a squelch state when the squelch timer expires before the idle timer and disable the data path.

Abstract: Various embodiments relate to an apparatus and method for squelching and unsquelching serial port ingress traffic, including a squelch timer, an idle timer and a state machine which is configured to enable squelch and enable a data path, load and start the squelch timer when a character is received by the serial port, load and start the idle timer, activate a squelch state when the squelch timer expires before the idle timer and disable the data path.

Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.

Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.

Abstract: A method and apparatus for optimizing redundant link usage allows a portion of the wasted bandwidth in a redundant link system to be utilized for additional data traffic without compromising the ability of the system to respond to and correct for a failure of a link. In one embodiment, one of two independent, individually addressable links is selected as a nominal communication path, and the other as a standby communication path. The path independent traffic is sent via the nominal communication path, while the path dependent data is sent via the nominal communication path or the standby path, in accordance with the dependence of the traffic. In another embodiment, critical time sensitive traffic is sent via a nominal and standby time sensitive paths, while normal traffic is sent via nominal normal path, and non-critical traffic is sent via a standby normal path.

Abstract: A system for selecting an active control path link as a communication link between a control shelf and a controlled shelf in a multi-shelf network element is provided. The system includes a first and a second control path links connecting the control shelf to the controlled shelf. The system also includes an assessment module adapted to assess health of transmissions sent through each of the first and the second control path link and a selection module associated with the assessment module. The selection module is adapted to select the active control path link as either of the first and the second control path link utilizing a health report relating to the first and the second control path link generated by the assessment module.

Abstract: A system for selecting an active control path link as a communication link between a control shelf and a controlled shelf in a multi-shelf network element is provided. The system includes a first and a second control path links connecting the control shelf to the controlled shelf. The system also includes an assessment module adapted to assess health of transmissions sent through each of the first and the second control path link and a selection module associated with the assessment module. The selection module is adapted to select the active control path link as either of the first and the second control path link utilizing a health report relating to the first and the second control path link generated by the assessment module.

Abstract: The present invention comprises a method and apparatus for optimizing redundant link usage so as to allow a portion of the wasted bandwidth in a redundant link system to be utilized for additional data traffic without compromising the ability of the system to respond to and correct for a failure of a link. In one embodiment, two independent, individually addressable links are established between to endpoints. One of the links is selected as a nominal communication path, and the other as a standby communication path. Data traffic between the endpoints is divided into path independent traffic and path dependent traffic. The path independent traffic is sent via the nominal communication path, while the path dependent data is sent via the nominal communication path or the standby path, in accordance with the dependence of the traffic. In another embodiment, the nominal communication path and standby communication path each comprise a time sensitive path and a normal path.