Abstract: Photodiode and array of photodiodes on II-VI material and their production processes. The photodiodes (48) are formed in a type P, Hg.sub.1-x Cd.sub.x Te semiconductor layer (13) with 0.ltoreq.x.ltoreq.1 deposited directly on a CdTe insulating substrate (11), having an active zone (37) of type N, a first electrical contact (47) on the semiconductor layer, a second electrical contact (45) on the active zone, and insulant (21) separating the first and second electrical contacts and an insulation or isolation trench (15), whose depth exceeds the thickness of the active zone and surrounding the latter, the first electrical contact (47) being located in the bottom (27) of the trench.

Abstract: The invention relates to a process for producing an electric contact on a HgCdTe substrate having a P conductivity and application to the production of an N/P diode. For producing an N/P diode, an insulating layer deposited on the HgCdTe substrate is etched by ion bombardment through a first mask, so as to produce a first opening in said insulating layer. The mask is removed and the substrate covered by the insulating layer undergoes a heat treatment, so as to at least mitigate the P conductivity drop induced by the ion bombardment in a first portion of the substrate facing the first opening. This is followed by ion implantation in a second portion of the substrate through a second mask in order to produce an N conductivity portion. This second mask is removed and the insulating layer is etched through a third mask by ion bombardment in order to produce a second opening facing the second portion. After removing the third mask, conductive pads are produced in the first and second openings.