Patents by Inventor Jean-Marc Rollin

Jean-Marc Rollin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave/millimeter-wave waveguide to circuit board connector
    Patent number: 11342683
    Abstract: Circuit board connector that provides electrical connection between conductive traces in a printed circuit board and microwave/millimeter-wave components.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: May 24, 2022
    Assignee: Cubic Corporation
    Inventors: Timothy Smith, Jean-Marc Rollin, Jared Jordan, Brian Kerrigan, William Stacy
  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20200076042
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: May 23, 2019
    Publication date: March 5, 2020
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS
    Publication number: 20190393580
    Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
    Type: Application
    Filed: January 25, 2019
    Publication date: December 26, 2019
    Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
  • Microwave/Millimeter-Wave Waveguide to Circuit Board Connector
    Publication number: 20190334249
    Abstract: Circuit board connector that provides electrical connection between conductive traces in a printed circuit board and microwave/millimeter-wave components.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 31, 2019
    Inventors: Timothy Smith, Jean-Marc Rollin, Jared Jordan, Brian Kerrigan, William Stacy
  • Integrated electronic components and methods of formation thereof
    Patent number: 10431521
    Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: October 1, 2019
    Assignee: CUBIC CORPORATION
    Inventors: Jean-Marc Rollin, David W. Sherrer
  • Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal Interconnects and Contactors
    Publication number: 20190277910
    Abstract: Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Rick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
  • Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
    Patent number: 10361471
    Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: July 23, 2019
    Assignee: NUVOTRONICS, INC
    Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
  • Wafer scale test interface unit and contactors
    Patent number: 10310009
    Abstract: Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: June 4, 2019
    Assignee: NUVOTRONICS, INC
    Inventors: Rick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
  • Three-dimensional microstructures
    Patent number: 10305158
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: May 28, 2019
    Assignee: CUBIC CORPORATION
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
    Patent number: 10193203
    Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: January 29, 2019
    Assignee: NUVOTRONICS, INC
    Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
  • Integrated electronic components and methods of formation thereof
    Patent number: 10002818
    Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: June 19, 2018
    Assignee: Nuvotronics, Inc.
    Inventors: Jean-Marc Rollin, David W. Sherrer
  • STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS
    Publication number: 20180123217
    Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
    Type: Application
    Filed: January 3, 2018
    Publication date: May 3, 2018
    Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
  • INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
    Publication number: 20180082923
    Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 22, 2018
    Inventors: Jean-Marc Rollin, David W. Sherrer
  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20180069287
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: November 10, 2017
    Publication date: March 8, 2018
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • Three-dimensional microstructures
    Patent number: 9843084
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: December 12, 2017
    Assignee: NUVOTRONICS, INC
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • BATCH FABRICATED MICROCONNECTORS
    Publication number: 20170170592
    Abstract: Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.
    Type: Application
    Filed: January 12, 2017
    Publication date: June 15, 2017
    Inventors: David W. Sherrer, Jean-Marc Rollin
  • Batch fabricated microconnectors
    Patent number: 9583856
    Abstract: Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: February 28, 2017
    Assignee: Nuvotronics, Inc.
    Inventors: David W. Sherrer, Jean-Marc Rollin
  • WAFER SCALE TEST INTERFACT UNIT: LOW LOSS AND HIGH ISOLATION DEVICES AND METHODS FOR HIGH SPEED AND HIGH DENSITY MIXED SIGNAL INTERCONNECTS AND CONTACTORS
    Publication number: 20160341790
    Abstract: Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates. The device comprising a 3D coaxial distribution network structure including a plurality of coaxial transmission lines separated by a first pitch at the input and a second, wider pitch at the output thereof.
    Type: Application
    Filed: January 16, 2015
    Publication date: November 24, 2016
    Inventors: Rick L. Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko, Jean Marc Rollin
  • THREE-DIMENSIONAL MICROSTRUCTURES
    Publication number: 20160336639
    Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
    Type: Application
    Filed: July 28, 2016
    Publication date: November 17, 2016
    Inventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner
  • High frequency power combiner/divider
    Patent number: 9490517
    Abstract: Radio frequency (RF) power amplifiers are provided which may include high power, wideband, microwave or millimeter-wave solid state power amplifiers based on waveguide power combiner/dividers.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: November 8, 2016
    Assignee: Nuvotronics, Inc.
    Inventors: Donald X. Wu, David Sherrer, Jean-Marc Rollin