Abstract: The invention relates to an installation for treating wafers made of materials serving as microelectronics substrates including a tank for containing a treatment bath, a wafer support device capable of receiving at least one wafer of a first size, and an element for grasping and placing each wafer of the first size in the bath and for removing it therefrom. The installation further includes a support for receiving at least one wafer of a second size that is smaller than the first size, the shape of the support allowing it to be grasped by the grasping element and received by the wafer support device in the tank.

Abstract: The invention relates to a method of separating into two wafers (2,4) a plate (1) of material for manufacturing substrates for electronics, optics, or optoelectronics, or for manufacturing microsystems, said wafers being situated on either side of a plane of weakness (6), the method being characterized in that it comprises the steps consisting in: exerting a deformation force on at least one of the wafers so as to cause the wafers (2, 4) to separate from each other in a zone of the plate (1) at said plane of weakness; and exerting guided separation movement on the wafers (2, 4). The invention also provides apparatus (100) for implementing the method, which apparatus has gripping members (30, 32) suitable for exerting said deformation force and for performing said separation.