Patents by Inventor Jean-Pascal Michelet

Jean-Pascal Michelet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding a sheet of metal, such as copper, on an aluminum nitride substrate
    Patent number: 5150830
    Abstract: A method of bonding a sheet of metal such as copper on a substrate of aluminum nitride, the method comprising the following steps known per se: i) growing a layer of alumina on the aluminum nitride substrate by means of heat treatment; and ii) placing the sheet of metal on the alumina layer and then bonding them together; the method being wherein alumina-growing step i) is performed under a controlled oxidizing atmosphere which is free from moisture.
    Type: Grant
    Filed: February 20, 1991
    Date of Patent: September 29, 1992
    Assignee: Telemecanique
    Inventors: Jannick Guinet, Jean-Claude Hubert, Jean Jarrige, Jacques Mexmain, Jean-Pascal Michelet