Abstract: A headstone bracket devised to fit lengthwise over a headstone including a bracket having a center section which has either a single static piece or parallel slidingly engageable upper and lower portions adjustable to headstone upper side length and a leg extending from a bottom side of each upper and lower portion. A slot disposed on the upper portion slidingly receives a bolt disposed on the lower portion therethrough. A securing body, such as a finial, threadingly engages the bolt and a lock washer is removably attachable to the securing body between the bolt to secure the upper and lower portions in a selected lock position. At least one of a flag holder and a flower pot-supporting annular ring disposed on an outer end one of the upper portion and the lower portion, and a wreath-supporting hook disposed on an external end of one of the legs is provided.

Abstract: An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.

Abstract: The method is for estimating a phase and gain mismatch of a base band digital signal. It comprises: determining (10) weight coefficients depending upon the likelihood of the frequency values of a segment of said base band digital signal; and determining (26) the phase and gain mismatch for the segment using the weight coefficients.

Abstract: The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.

Abstract: The invention concerns a non intrusive control process of an xDSL transmission line from signals and messages exchanged between at least one emitter (1) to at least one receiver (2) at the end of or during a predefined handshaking procedure. This process comprises the following steps: a1. Analysing the type of signals exchanged between the emitter (1) and the receiver (2) during the establishment of the new contact, b1. Establishing a diagnosis on the state of the line according to the result of step b1.

Abstract: An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

Abstract: The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.

Abstract: A device for checking a transmission line carrying a plurality of digital and/or analogue transmission channels is provided. The device includes a measurement block designed to evaluate performances, search for faults and determine the quality of the line and services transmitted through the said line. A system for measuring disturbances is also provided. The system measures disturbances in a transmission line firstly connecting a subscriber to a high speed server through an xDSL modem, and secondly to a switched telephone network.

Abstract: A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

Abstract: The invention relates to a monitoring system and method for performing a connectivity check and a trace routing test in Ethernet based networks built around VLAN switching. For the connectivity check, a beacon frame is inserted at an originating point by an initiating test unit for transmission to a destination point provided with a loop for returning a response frame to the initiating test unit whenever the beacon frame is received, thereby confirming connectivity between the originating and destination points. For the trace routing test, a marker frame is inserted at the originating point by the initiating test unit and monitored as it passes through network nodes along its way towards the destination point. At any node where the beacon frame is detected, a tracing frame containing a copy of the marker frame is returned to the initiating test unit to build a sequential list of every node where the marker frame is detected.

Abstract: A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

Abstract: An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.

Abstract: An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

Abstract: Method for distributing hardware and software resources for testing links between a plurality of subscriber devices and a telecommunications operator in a telecommunications network, comprising: a central control site (2), at least one intermediate connection site (4), connected on the one hand to the central site (2) by a first transmission line (3), and on the other hand to the subscriber devices (12) by a second transmission line (13). This method is characterised by the following steps: defining the tests to be performed on the first line (3) and the tests to be performed on the second line (13), distributing said hardware and software resources between said central site (2) and said intermediate connection site (4) depending on the tests likely to be performed on the first transmission line (3) and on the second transmission line (13) respectively.

Abstract: The invention relates to a method for evaluating the bandwidth between a first point and a second point liable to exchange digital data packets in a telecommunications network including a plurality of sub-networks. The method according to the invention includes the following steps: for each transmission direction through at least one of said sub-networks, associating a same identifier with the quasi-simultaneously transmitted packets, time-stamping and recording the received packets, identifying and sorting the packets received with the same identifier, selecting the largest possible integral number m of groups of packets with the same identifier, measuring the time intervals separating the instants when the packets of the selected groups are received by the second point, calculating the bandwidth according to the number of packets of the selected groups and to said total transmission time of said packets.

Abstract: The method is for estimating a phase and gain mismatch of a base band digital signal. It comprises: determining (10) weight coefficients depending upon the likelihood of the frequency values of a segment of said base band digital signal; and determining (26) the phase and gain mismatch for the segment using the weight coefficients.

Abstract: The invention relates to a device for checking (1) a transmission line carrying a plurality of digital and/or analogue channels comprising a measurement block (14) designed to evaluate performances, search for faults and determine the quality of the line and services transmitted through the said line. According to the invention, the device also comprises a switching module (16) capable of selectively connecting the measurement block (14) only to the transmission channels to be checked and to keep other channels in the transmission line active.