Patents by Inventor Jean Vangsness
Jean Vangsness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7534163Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.Type: GrantFiled: February 28, 2008Date of Patent: May 19, 2009Assignee: innoPad, Inc.Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
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Publication number: 20080146131Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.Type: ApplicationFiled: February 28, 2008Publication date: June 19, 2008Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
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Patent number: 7357704Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.Type: GrantFiled: June 15, 2006Date of Patent: April 15, 2008Assignee: innoPad, Inc.Inventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
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Patent number: 7186166Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.Type: GrantFiled: November 14, 2005Date of Patent: March 6, 2007Assignees: International Business Machines Corporation, Freudenberg Nonwovens Ltd.Inventors: Shyng-Tsong Chen, Kenneth Davis, Oscar Kai Chi Hsu, Kenneth Rodbell, Jean Vangsness
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Publication number: 20060223424Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.Type: ApplicationFiled: June 15, 2006Publication date: October 5, 2006Inventors: Jean VANGSNESS, Oscar HSU, Alaka POTNIS
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Patent number: 7086932Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.Type: GrantFiled: May 11, 2004Date of Patent: August 8, 2006Assignee: Freudenberg NonwovensInventors: Jean Vangsness, Oscar Kai Chi Hsu, Alaka Potnis
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Publication number: 20060116059Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.Type: ApplicationFiled: November 14, 2005Publication date: June 1, 2006Applicants: International Business Machines Corporation, Freudenberg Nonwovens Ltd.Inventors: Shyng-Tsong Chen, Kenneth Davis, Oscar Hsu, Kenneth Rodbell, Jean Vangsness
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Patent number: 6989117Abstract: A method of making a polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The method comprising placing the fibers and the precursors in a cavity of a mold for shaping the polishing pad; applying a differential pressure across a mold cavity, where the differential pressure and the amount of precursors are sufficient to cause the precursors to fill the interstices substantially completely before completion of the reaction; and applying sufficient heat to the mold to at least partially cure the polishing pad by causing the precursors to react.Type: GrantFiled: February 23, 2004Date of Patent: January 24, 2006Assignee: International Business Machines CorporationInventors: Shyng-Tsong Chen, Kenneth P. Rodbell, Oscar Kai Chi Hsu, Jean Vangsness, David S. Gilbride, Scott Clayton Billings, Kenneth Davis
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Publication number: 20050255794Abstract: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.Type: ApplicationFiled: May 11, 2004Publication date: November 17, 2005Inventors: Jean Vangsness, Oscar Hsu, Alaka Potnis
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Patent number: 6964604Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.Type: GrantFiled: April 5, 2004Date of Patent: November 15, 2005Assignees: International Business Machines Corporation, Freudenberg Nonwovens Ltd.Inventors: Shyng-Tsong Chen, Kenneth Davis, Oscar Kai Chi Hsu, Kenneth Rodbell, Jean Vangsness
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Publication number: 20050079805Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.Type: ApplicationFiled: April 5, 2004Publication date: April 14, 2005Applicants: International Business Machines CorporationInventors: Shyng-Tsong Chen, Kenneth Davis, Oscar Chi Hsu, Kenneth Rodbell, Jean Vangsness
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Publication number: 20040162013Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.Type: ApplicationFiled: February 23, 2004Publication date: August 19, 2004Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, FREUDENBERG NONWOVENS, LTD. PARTNERSHIPInventors: Shyng-Tsong Chen, Kenneth P. Rodbell, Oscar Kai Chi Hsu, Jean Vangsness, David S. Gilbride, Scott Clayton Billings, Kenneth Davis
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Patent number: 6712681Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.Type: GrantFiled: November 20, 2000Date of Patent: March 30, 2004Assignee: International Business Machines CorporationInventors: Shyng-Tsong Chen, Kenneth P. Rodbell, Oscar Kai Chi Hsu, Jean Vangsness, David S. Gilbride, Scott Clayton Billings, Kenneth Davis
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Patent number: 6383066Abstract: A multilayered polishing pad especially suitable for chemical-mechanical polishing or planarizing metal, semiconductor or optical surfaces is provided. The invention allows the mechanical and polishing properties of the several layers to be independently varied.Type: GrantFiled: June 23, 2000Date of Patent: May 7, 2002Assignee: International Business Machines CorporationInventors: Shyng-Tsong Chen, Alex Siu Keung Chung, Oscar Kai Chi Hsu, Kenneth P. Rodbell, Jean Vangsness