Abstract: A method for manufacturing a condenser microphone includes forming a diaphragm module using microelectromechanical system (MEMS) techniques. The diaphragm module includes a diaphragm that is deformable by energy of sound waves, and a diaphragm spacer that extends from one side of the diaphragm and controls a tension of the diaphragm. The method further includes providing a backplate with vent holes, aligning the vent holes of the backplate with a central region of the diaphragm, and connecting the backplate to the diaphragm spacer to construct a transducer unit. The diaphragm spacer, the diaphragm and the backplate cooperate to form an air chamber in fluid communication with an environment external to the condenser microphone. The backplate and the diaphragm cooperate to form a condenser. The method further includes enclosing the transducer unit in a housing that includes a shell and a circuit board to form the condenser microphone.

Abstract: A method for manufacturing a condenser microphone includes forming a diaphragm module using microelectromechanical system (MEMS) techniques. The diaphragm module includes a diaphragm that is deformable by energy of sound waves, and a diaphragm spacer that extends from one side of the diaphragm and controls a tension of the diaphragm. The method further includes providing a backplate with vent holes, aligning the vent holes of the backplate with a central region of the diaphragm, and connecting the backplate to the diaphragm spacer to construct a transducer unit. The diaphragm spacer, the diaphragm and the backplate cooperate to form an air chamber in fluid communication with an environment external to the condenser microphone. The backplate and the diaphragm cooperate to form a condenser. The method further includes enclosing the transducer unit in a housing that includes a shell and a circuit board to form the condenser microphone.

Abstract: A method for making a diaphragm unit of a condenser microphone includes the steps of: forming a liftoff layer on a substrate; forming an insulator diaphragm film on the liftoff layer; and removing the liftoff layer from the diaphragm film and the substrate so as to separate the diaphragm film from the substrate.

Abstract: A condenser microphone package includes: a condenser microphone unit including a diaphragm and a back plate; a printed circuit board; a conductive connector sandwiched between and cooperating with the condenser microphone unit and the printed circuit board to form a stack; and a metal can encasing the stack and having a first end wall that is formed with a plurality of sound holes, and that abuts against the condenser microphone unit, and a second end wall that is disposed opposite to the first end wall, that abuts against the printed circuit board, and that cooperates with the first end wall to press the printed circuit board toward the condenser microphone unit.

Abstract: A method for making condenser microphones includes: forming a fixed electrode layer structure of a plurality of fixed electrode units; forming a sacrificial layer of a plurality of sacrificial units on one side of the fixed electrode layer structure; forming a diaphragm layer structure of a plurality of diaphragm units on the sacrificial layer; forming a patterned mask layer on an opposite side of the fixed electrode layer structure opposite to the sacrificial layer; forming a plurality of etching channels, each of which extends through the patterned mask layer and the fixed electrode layer structure; removing a portion of the sacrificial layer of each of the sacrificial units so as to form a spacer between a respective one of the fixed electrode units and a respective one of the diaphragm units; and removing the patterned mask layer.

Abstract: A method for making condenser microphones includes: forming a fixed electrode layer structure of a plurality of fixed electrode units; forming a sacrificial layer of a plurality of sacrificial units on one side of the fixed electrode layer structure; forming a diaphragm layer structure of a plurality of diaphragm units on the sacrificial layer; forming a patterned mask layer on an opposite side of the fixed electrode layer structure opposite to the sacrificial layer; forming a plurality of etching channels, each of which extends through the patterned mask layer and the fixed electrode layer structure; removing a portion of the sacrificial layer of each of the sacrificial units so as to form a spacer between a respective one of the fixed electrode units and a respective one of the diaphragm units; and removing the patterned mask layer.

Abstract: A method for making a diaphragm unit of a condenser microphone includes the steps of: forming a liftoff layer on a substrate; forming an insulator diaphragm film on the liftoff layer; and removing the liftoff layer from the diaphragm film and the substrate so as to separate the diaphragm film from the substrate.