Patents by Inventor Jee Ho LEE

Jee Ho LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163466
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. Coding decision information of a representative channel of a target block is shared as coding decision information of a target channel of the target block, and decoding of the target block is performed using the coding decision information of the target channel. Since the coding decision information of the representative channel is shared with an additional channel, repeated signaling of identical coding decision information may be prevented. By means of this prevention, the efficiency of encoding and decoding of the target block or the like may be improved.
    Type: Application
    Filed: December 27, 2023
    Publication date: May 16, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, RESEARCH AND BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Dong-San JUN, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Jin-Ho Lee, Ha-Hyun Lee, Byeung-Woo Jeon, Hui-Yong Kim, Jee-Yoon Park
  • Publication number: 20240153095
    Abstract: A side outer extraction method may include receiving, by at least one processor, an image, of a vehicle, preprocessed from three-dimensional (3D) data from a computer-aided design (CAD) module, detecting, using an artificial intelligence model, a classification value and a bounding box for each region, of a plurality of regions, corresponding to one of a plurality of target references of the preprocessed image, transmitting, to the CAD module, a signal indicating the classification value and the bounding box for each region of the plurality of regions, and causing extraction, by the CAD module, of the plurality of target references from the classification value and the bounding box for each region of the plurality of regions, based on the received signal.
    Type: Application
    Filed: August 7, 2023
    Publication date: May 9, 2024
    Inventors: SungHyun Park, Sang Hwan Jun, Jee-Hyong Lee, Eun-Ho Lee, Tae-Hyun Kim, Jin Sub Lee
  • Patent number: 11940501
    Abstract: The present invention relates to a method and an apparatus for diagnosing low voltage of a secondary battery cell. The method for diagnosing low voltage of a secondary battery cell according to an embodiment of the present invention includes pre-aging a battery cell, charging the battery cell according to a preset charging condition, measuring a parameter for determining low voltage failure of the battery cell, comparing the measured parameter with a reference parameter, and performing formation when the battery cell is determined to be normal.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: March 26, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Yong Tae Lee, Myung Hoon Ko, Jee Ho Kim, Gyung Soo Kang
  • Patent number: 11916258
    Abstract: A secondary battery comprises an electrode assembly, a can, and an insulator. The electrode assembly includes a first electrode, a separator, and a second electrode alternately stacked and wound. The can has an accommodation part accommodating the electrode assembly therein, and the can comprises a first can and a second can having cylindrical shapes open in a direction facing each other. The insulator insulates an overlapping portion between the first can and the second can. The first can is electrically connected to the first electrode, and the second can is electrically connected to the second electrode. The insulator has a short-circuit induction through-part defined by a through-hole or a cutoff line, such that a short circuit occurs between the first can and the second can through the short-circuit induction through-part when it is deformed in shape as heat or a pressure is applied to contract or expand the insulator.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: February 27, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Gyung Soo Kang, Jee Ho Kim, Yong Tae Lee, Myung Hoon Ko, Jung Il Park, Ki Youn Kim
  • Patent number: 9558979
    Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: January 31, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwa Seob Choi, Yu Sung Jang, Tai Young Eum, Jee Ho Lee
  • Publication number: 20140319784
    Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.
    Type: Application
    Filed: October 4, 2013
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwa Seob CHOI, Yu Sung JANG, Tai Young EUM, Jee Ho LEE