Patents by Inventor Jee Hun Hong

Jee Hun Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same
    Patent number: 9056690
    Abstract: There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: June 16, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joo Yong Kim, Seung Ki Choi, Jee Hun Hong
  • RESIN DISPENSING APPARATUS FOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME
    Publication number: 20140014682
    Abstract: There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.
    Type: Application
    Filed: September 17, 2013
    Publication date: January 16, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joo Yong KIM, Seung Ki CHOI, Jee Hun HONG
  • Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same
    Patent number: 8546153
    Abstract: There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: October 1, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Yong Kim, Seung Ki Choi, Jee Hun Hong
  • RESIN DISPENSING APPARATUS FOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME
    Publication number: 20120129281
    Abstract: There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.
    Type: Application
    Filed: November 14, 2011
    Publication date: May 24, 2012
    Inventors: Joo Yong KIM, Seung Ki Choi, Jee Hun Hong