Patents by Inventor Jeff Chunchieh Huang

Jeff Chunchieh Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for providing getters in microelectromechanical systems
    Patent number: 11945713
    Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 2, 2024
    Assignee: INVENSENSE, INC.
    Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
  • SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL SYSTEMS
    Publication number: 20220348455
    Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
    Type: Application
    Filed: July 15, 2022
    Publication date: November 3, 2022
    Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
  • CMOS-MEMS integrated device without standoff in MEMS
    Patent number: 10773951
    Abstract: An apparatus includes a MEMS wafer with a device layer and a handle substrate bonded to the device layer. The apparatus also includes a CMOS wafer including an oxide layer, and a passivation layer overlying the oxide layer. A bonding electrode overlies the passivation layer and a bump stop electrode overlies the passivation layer. A eutectic bond is between a first bonding metal on the bonding electrode and a second bonding metal on the MEMS wafer. A sensing electrode is positioned adjacent to the bump stop electrode and the bonding electrode. A sensing gap is positioned between the sensing electrode and the device layer, wherein the sensing gap is greater than a bump stop gap positioned between the bump stop electrode and the device layer.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 15, 2020
    Assignee: InvenSense, Inc.
    Inventors: Daesung Lee, Jeff Chunchieh Huang
  • CMOS-MEMS INTEGRATED DEVICE WITHOUT STANDOFF IN MEMS
    Publication number: 20190382258
    Abstract: An apparatus includes a MEMS wafer with a device layer and a handle substrate bonded to the device layer. The apparatus also includes a CMOS wafer including an oxide layer, and a passivation layer overlying the oxide layer. A bonding electrode overlies the passivation layer and a bump stop electrode overlies the passivation layer. A eutectic bond is between a first bonding metal on the bonding electrode and a second bonding metal on the MEMS wafer. A sensing electrode is positioned adjacent to the bump stop electrode and the bonding electrode. A sensing gap is positioned between the sensing electrode and the device layer, wherein the sensing gap is greater than a bump stop gap positioned between the bump stop electrode and the device layer.
    Type: Application
    Filed: March 27, 2019
    Publication date: December 19, 2019
    Inventors: Daesung LEE, Jeff Chunchieh HUANG
  • SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL SYSTEMS
    Publication number: 20190330052
    Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
    Type: Application
    Filed: July 8, 2019
    Publication date: October 31, 2019
    Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
  • Systems and methods for providing getters in microelectromechanical systems
    Patent number: 10384930
    Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 20, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman
  • SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL SYSTEMS
    Publication number: 20180312396
    Abstract: Systems and methods are provided that provide a getter in a micromechanical system. In some embodiments, a microelectromechanical system (MEMS) is bonded to a substrate. The MEMS and the substrate have a first cavity and a second cavity therebetween. A first getter is provided on the substrate in the first cavity and integrated with an electrode. A second getter is provided in the first cavity over a passivation layer on the substrate. In some embodiments, the first cavity is a gyroscope cavity, and the second cavity is an accelerometer cavity.
    Type: Application
    Filed: April 26, 2017
    Publication date: November 1, 2018
    Inventors: Daesung Lee, Jeff Chunchieh Huang, Jongwoo Shin, Bongsang Kim, Logeeswaran Veerayah Jayaraman