Patents by Inventor Jeff Echtenkamp

Jeff Echtenkamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mask programmable interface selection
    Patent number: 8772915
    Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: July 8, 2014
    Assignee: Broadcom Corporation
    Inventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
  • Mask Programmable Interface Selection
    Publication number: 20110254158
    Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.
    Type: Application
    Filed: June 30, 2011
    Publication date: October 20, 2011
    Inventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
  • Semiconductor die with mask programmable interface selection
    Patent number: 7982294
    Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: July 19, 2011
    Assignee: Broadcom Corporation
    Inventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
  • Semiconductor die with mask programmable interface selection
    Publication number: 20080224307
    Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 18, 2008
    Inventors: Tarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp