Patents by Inventor Jeffery Howerton
Jeffery Howerton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9346130Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.Type: GrantFiled: December 17, 2008Date of Patent: May 24, 2016Assignee: Electro Scientific Industries, Inc.Inventors: Weisheng Lei, Glenn Simenson, Hisashi Matsumoto, Guangyu Li, Jeffery Howerton
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Patent number: 9302350Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.Type: GrantFiled: December 17, 2008Date of Patent: April 5, 2016Assignee: Electro Scientific Industries, Inc.Inventors: Weisheng Lei, Glenn Simenson, Hisashi Matsumoto, Guangyu Li, Jeffery Howerton
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Patent number: 8729404Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.Type: GrantFiled: March 2, 2011Date of Patent: May 20, 2014Assignee: Electro Scientific Industries, Inc.Inventors: Glenn Simenson, William Antoni, Steven Cohen, Jeffery Howerton
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Publication number: 20110147067Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.Type: ApplicationFiled: March 2, 2011Publication date: June 23, 2011Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Glenn Simenson, William Antoni, Steven Cohen, Jeffery Howerton
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Publication number: 20110151046Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.Type: ApplicationFiled: March 2, 2011Publication date: June 23, 2011Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Glenn Simenson, William Antoni, Steven Cohen, Jeffery Howerton
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Patent number: 7943862Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.Type: GrantFiled: August 20, 2008Date of Patent: May 17, 2011Assignee: Electro Scientific Industries, Inc.Inventors: Glenn Simenson, William Antoni, Steven Cohen, Jeffery Howerton
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Publication number: 20100147813Abstract: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.Type: ApplicationFiled: December 17, 2008Publication date: June 17, 2010Applicant: Electro Scientific Industries, Inc.Inventors: Weisheng Lei, Glenn Simenson, Hisashi Matsumoto, Guangyu Li, Jeffery Howerton
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Publication number: 20100044092Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Applicant: Electro Scientific Industries, Inc.Inventors: Glenn Simenson, William Antoni, Steve Cohen, Jeffery Howerton