Abstract: A substrate container and a bottom plate are connected with a mechanism for adjusting the distance between the container and bottom plate, by, e.g., a threaded connection between two members of the connector mechanism. Also provided are a duck-billed valve for venting the container and a dampener for minimizing damage due to shocks.

Abstract: A container for holding a plurality of wafers in an axially aligned, generally parallel spaced apart arrangement includes an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an open front. At least one wafer support is provided in the enclosure along with a kinematic coupling on the bottom of the enclosure. The container has a door for sealingly closing the open front which includes a chassis and an operable latching mechanism on the chassis. The latching mechanism includes a cam selectively rotatable to shift the latching mechanism between a first favored position and a second favored position and at least one vibration dampener for dampening vibrations generated when the latching mechanism is shifted between the first and second favored positions.

Abstract: A container for holding a wafer includes an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an opposing open front defined by a door frame. A door is sealingly engagable in the door frame to close the open front. The container further includes wafer restraint means in the enclosure including fixed wafer restraint means and operable wafer restraint means. The operable wafer restraint means is selectively positionable by engaging and disengaging the door from the door frame, and is positioned so to enable insertion or removal of a wafer from the container when the door is disengaged from the door frame and positioned so as to cooperate with the fixed wafer restraint means to restrain the wafer in the container when the door is engaged in the door frame.

Abstract: A semiconductor wafer, substrate, or reticle storage or shipping device that includes a photochromic indicator of exposure to undesired electromagnetic radiation. The present invention includes the incorporation of a photochromic material into the plastic used to fabricate at least a portion of a semiconductor wafer, disk, or reticle shipping or storage containers. The container may include photochromic material in the form of a transparent window or a larger portion of the container. The photochromic material may change color or darkness in response to exposure to a selected range of wavelengths of light.

Abstract: A composition and method of application of the composition to produce masks of the type particularly useful in the manufacture of varnished electronic terminals and components is specified. The composition consists of mixing acetone, nitrocellulose, methyl isobutyl ketone (MIBK), arylsulfonamide formaldehyde resin, and tri (b-chloroethyl) phosphate, a fire retardant, under carefully controlled conditions. This masking product is applied, prior to the varnish, on an electronic part and is subjected to heating in the varnish curing oven to about 200.degree. F. whereupon the masking product will carbonize. The resulting carbonized coating is easily removed by brushing to produce a varnish mask where the masking product was applied.