Patents by Inventor Jeffrey A. Wright
Jeffrey A. Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12002555Abstract: Techniques for generating healthcare form bundles with supplemental live image documentation are disclosed. The techniques include: obtaining, from a user, values of fields of a healthcare form; capturing a live image including supplemental documentation for the healthcare form, from a camera of a device operated by the user; generating a form bundle including (a) an electronic version of the healthcare form populated with the values, and (b) the image including the supplemental documentation for the healthcare form; and transmitting the form bundle to a healthcare organization.Type: GrantFiled: September 18, 2020Date of Patent: June 4, 2024Assignee: DATAVANT, INC.Inventors: Jeffrey Marrone, Brian Korb, Jefferson Seidl, Sean Wright
-
Patent number: 11949680Abstract: Disclosed is an improved approach to implement a mechanism to provide customer control over access to cloud infrastructure by the cloud provider's operator employees. This mechanism allow customer controlled access to any cloud infrastructure that belongs to or is otherwise allocated to the customer.Type: GrantFiled: April 30, 2021Date of Patent: April 2, 2024Assignee: Oracle International CorporationInventors: Prasanna Ramamurthi, Joydip Kundu, Binoy Sukumaran, Krishna Chander, Jeffrey Wright
-
Publication number: 20240104664Abstract: In an embodiment, a method is provided. The method includes receiving claim edit information including a plurality of claim edits made to a plurality of claims at a first time interval, where the plurality of claim edits are made using a rule; receiving claim information representing the status of the plurality of claims at a second time interval; and determining a persistence value based on the plurality of claims at a second time interval and the plurality of claim edits made at a first time interval.Type: ApplicationFiled: September 15, 2022Publication date: March 28, 2024Inventors: Sheila Miller, Michael Bradigan, Jeffrey Wright, Michael Marcus, Andrew Laurer, Lourn Bun, Mona Schuessler
-
Publication number: 20240103287Abstract: A removable facial interface for a head-mountable device (HMD) is disclosed. In an example, an HMD includes a display; a facial interface frame at least partially surrounding the display; a removable facial interface attached to the facial interface frame; a first attachment mechanism attached to one of the facial interface frame or the removable facial interface; and a second attachment mechanism attached to the other of the facial interface frame or the removable facial interface, the removable facial interface being attached to the facial interface frame by the first attachment mechanism and the second attachment mechanism.Type: ApplicationFiled: September 19, 2023Publication date: March 28, 2024Inventors: Erin M. Bosch, Darshan R. Kasar, Timon A. Wright, Nicholas R. Trincia, Jonathan M. Anderson, Liam R. Martinez, Ian A. Guy, Paul X. Wang, Samuel G. Smith, Jeffrey A. Griffis, Andrew Gallaher
-
Publication number: 20220353266Abstract: Disclosed is an improved approach to implement a mechanism to provide customer control over access to cloud infrastructure by the cloud provider's operator employees. This mechanism allow customer controlled access to any cloud infrastructure that belongs to or is otherwise allocated to the customer.Type: ApplicationFiled: April 30, 2021Publication date: November 3, 2022Applicant: Oracle International CorporationInventors: Prasanna RAMAMURTHI, Joydip KUNDU, Binoy SUKUMARAN, Krishna CHANDER, Jeffrey WRIGHT
-
Patent number: 9945071Abstract: The present invention pertains to carpet and methods of making and recycling carpet. In one aspect, the carpet includes: a primary backing which has a face and a back surface; a plurality of fibers attached to the primary backing and extending from the face of the primary backing and exposed at the back surface of the primary backing; an adhesive composition backing; and an optional secondary backing adjacent to the adhesive backing. The method of making carpet includes extrusion coating the adhesive composition onto the back surface of a primary backing to form the adhesive composition backing. The method of recycling carpet can recover one or more polymeric carpet components.Type: GrantFiled: May 8, 2013Date of Patent: April 17, 2018Assignee: Columbia Insurance CompanyInventors: Jeffrey Wright, Kellie Ballew
-
Patent number: 9922729Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: GrantFiled: September 13, 2017Date of Patent: March 20, 2018Assignee: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Publication number: 20180005710Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: ApplicationFiled: September 13, 2017Publication date: January 4, 2018Applicant: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Patent number: 9793008Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: GrantFiled: December 16, 2016Date of Patent: October 17, 2017Assignee: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Publication number: 20170098480Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: ApplicationFiled: December 16, 2016Publication date: April 6, 2017Applicant: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Patent number: 9558851Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: GrantFiled: April 19, 2016Date of Patent: January 31, 2017Assignee: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Publication number: 20160232987Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: ApplicationFiled: April 19, 2016Publication date: August 11, 2016Applicant: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Patent number: 9359773Abstract: Described herein are methods for manufacturing resilient floor coverings made from non-vinyl materials.Type: GrantFiled: August 20, 2013Date of Patent: June 7, 2016Assignee: COLUMBIA INSURANCE COMPANYInventors: Kris Edward Hahn, Jeffrey Wright, Kellie Ballew
-
Patent number: 9343184Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: GrantFiled: April 7, 2014Date of Patent: May 17, 2016Assignee: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Patent number: 9202595Abstract: An apparatus for post package repair can include memory cells in a package. A storage element can store information responsive to a post-package repair mode being activated. The information can identify an address mapped to a portion of the memory cells to be repaired. The storage element can store the information responsive to data received from nodes of the package. A walking token circuit can interrogate the information stored in the storage element in a serial fashion responsive to the post-package repair mode being activated. A mapping circuit can remap, responsive to the interrogation, the address to be repaired to another portion of the memory cells.Type: GrantFiled: November 12, 2013Date of Patent: December 1, 2015Assignee: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Publication number: 20150287480Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.Type: ApplicationFiled: April 7, 2014Publication date: October 8, 2015Applicant: Micron Technology, Inc.Inventors: Alan J. Wilson, Jeffrey Wright
-
Publication number: 20150135038Abstract: Apparatuses and methods for post package repair are disclosed. An apparatus can include memory cells in a package. A storage element can store information responsive to a post-package repair mode being activated. The information can identify an address mapped to a portion of the memory cells to be repaired. The storage element can store the information responsive to data received from nodes of the package. A walking token circuit can interrogate the information stored in the storage element in a serial fashion responsive to the post-package repair mode being activated. A mapping circuit can remap, responsive to the interrogation, the address to be repaired to another portion of the memory cells.Type: ApplicationFiled: November 12, 2013Publication date: May 14, 2015Applicant: MICRON TECHNOLOGY, INC.Inventors: Alan J. Wilson, Jeffrey Wright
-
Patent number: 8963087Abstract: An infrared light sensor for an infrared light detector (1), including a substrate membrane section (2) and at least two sensor chips (7 to 10), which are fastened next to each other on the substrate membrane section (2) and each comprise a layer element (11) which is produced from pyroelectrically sensitive material and is electrically contacted by a base electrode (12) and a head electrode (13) and is arranged in such that there is a voltage difference in each case between the head electrode (13) and the base electrode (12) of each layer element (11) when the layer elements (11) are irradiated with infrared light; and a coupling line (14 to 16) in each case for two adjacently arranged sensor chips (7 to 10), the coupling line coupling the head electrode (13) of the one sensor chip (7 to 9) and the base electrode (12) of the other sensor chip (8 to 10) to each other in an electrically conductive manner so that the layer elements (11) of the sensor chips (7 to 10) are connected in a series circuit, which hasType: GrantFiled: April 16, 2010Date of Patent: February 24, 2015Assignee: Pyreos Ltd.Inventors: Carsten Giebeler, Jeffrey Wright, Tim Chamberlain
-
Patent number: 8859085Abstract: Described herein is a resilient floor covering made from non-vinyl materials. Also disclosed are related methods for manufacturing the resilient floor coverings described herein.Type: GrantFiled: May 2, 2011Date of Patent: October 14, 2014Assignee: Columbia Insurance CompanyInventors: Kris Edward Hahn, Jeffrey Wright, Kellie Ballew
-
Publication number: 20130333821Abstract: Described herein are methods for manufacturing resilient floor coverings made from non-vinyl materials.Type: ApplicationFiled: August 20, 2013Publication date: December 19, 2013Applicant: Shaw Industries Group, Inc.Inventors: KRIS EDWARD HAHN, JEFFREY WRIGHT, KELLIE BALLEW