Patents by Inventor Jeffrey B. Danielson

Jeffrey B. Danielson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6998327
    Abstract: A thin film transfer join process in which a multilevel thin film structure is formed on a carrier, the multilevel thin film structure is joined to a final substrate and then the carrier is removed. Once the carrier is removed, the dielectric material and metallic material that were once joined to the carrier are now exposed. The dielectric material is then etched back so that the exposed metallic material protrudes beyond the dielectric material. Also disclosed is a module made by the foregoing process.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: February 14, 2006
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Wayne Oonk, Chandrika Prasad, Eric Daniel Perfecto, Roy Yu
  • Publication number: 20040097078
    Abstract: A thin film transfer join process in which a multilevel thin film structure is formed on a carrier, the multilevel thin film structure is joined to a final substrate and then the carrier is removed. Once the carrier is removed, the dielectric material and metallic material that were once joined to the carrier are now exposed. The dielectric material is then etched back so that the exposed metallic material protrudes beyond the dielectric material. Also disclosed is a module made by the foregoing process.
    Type: Application
    Filed: November 19, 2002
    Publication date: May 20, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Wayne Oonk, Chandrika Prasad, Eric Daniel Perfecto, Roy Yu