Patents by Inventor Jeffrey Bisberg
Jeffrey Bisberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9941258Abstract: An LED lead frame assembly includes a circuit strip assembly, a plastic dam member overmolded onto the circuit strip assembly and a LED chip assembly disposed in a pocket of the plastic dam member. The LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.Type: GrantFiled: December 17, 2014Date of Patent: April 10, 2018Assignee: GE LIGHTING SOLUTIONS, LLCInventors: Ming Kong, Jeffrey Bisberg, John Powell
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Patent number: 9648694Abstract: A light fixture includes a dimmable light source that emits light downwardly, and a downward-looking rangefinder proximate and operatively coupled with the light source. When the rangefinder detects an object at a measured height that exceeds a first threshold, the light source dims according to the measured height. A light fixture that provides illumination for a lighted area includes one or more first light sources that emit high-angle light, and one or more dimmable second light sources that emit low-angle light, into the lighted area. The system also includes a camera that captures images of the lighted area, and an controller that is (a) operable to identify one or more activity locations within the lighted area from the images, and (b) operatively coupled to dim one or more of the light sources that illuminate the one or more activity locations.Type: GrantFiled: April 11, 2016Date of Patent: May 9, 2017Assignee: GE LIGHTING SOLUTIONS, LLCInventors: Neil P. Cannon, Jeffrey Bisberg, John Lembke
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Publication number: 20160227619Abstract: A light fixture includes a dimmable light source that emits light downwardly, and a downward-looking rangefinder proximate and operatively coupled with the light source. When the rangefinder detects an object at a measured height that exceeds a first threshold, the light source dims according to the measured height. A light fixture that provides illumination for a lighted area includes one or more first light sources that emit high-angle light, and one or more dimmable second light sources that emit low-angle light, into the lighted area. The system also includes a camera that captures images of the lighted area, and an controller that is (a) operable to identify one or more activity locations within the lighted area from the images, and (b) operatively coupled to dim one or more of the light sources that illuminate the one or more activity locations.Type: ApplicationFiled: April 11, 2016Publication date: August 4, 2016Inventors: Neil P. CANNON, Jeffrey BISBERG, John LEMBKE
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Publication number: 20160178133Abstract: An LED lead frame assembly includes a circuit strip assembly, a plastic dam member overmoulded onto the circuit strip assembly and a LED chip assembly disposed in a pocket of the plastic dam member. The LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.Type: ApplicationFiled: December 17, 2014Publication date: June 23, 2016Inventors: Ming KONG, Jeffrey BISBERG, John POWELL
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Patent number: 9338850Abstract: A light fixture includes a dimmable light source that emits light downwardly, and a downward-looking rangefinder proximate and operatively coupled with the light source. When the rangefinder detects an object at a measured height that exceeds a first threshold, the light source dims according to the measured height. A light fixture that provides illumination with active glare control for a lighted area includes one or more first light sources that emit high-angle light, and one or more dimmable second light sources that emit low-angle light, into the lighted area. The system also includes a camera that captures images of the lighted area, and an controller that is (a) operable to identify one or more activity locations within the lighted area from the images, and (b) operatively coupled to dim one or more of the light sources that illuminate the one or more activity locations.Type: GrantFiled: April 23, 2014Date of Patent: May 10, 2016Assignee: GE LIGHTING SOLUTIONS, LLCInventors: Neil P. Cannon, Jeffrey Bisberg, John Lembke
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Patent number: 9076951Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.Type: GrantFiled: March 13, 2013Date of Patent: July 7, 2015Assignee: ALBEO TECHNOLOGIES, INC.Inventors: Ming Kong, John Powell, Jeffrey Bisberg
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Patent number: 8981629Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.Type: GrantFiled: March 13, 2013Date of Patent: March 17, 2015Assignee: Albeo Technologies, Inc.Inventors: Ming Kong, John Powell, Jeffrey Bisberg
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Publication number: 20140320023Abstract: A light fixture includes a dimmable light source that emits light downwardly, and a downward-looking rangefinder proximate and operatively coupled with the light source. When the rangefinder detects an object at a measured height that exceeds a first threshold, the light source dims according to the measured height. A light fixture that provides illumination with active glare control for a lighted area includes one or more first light sources that emit high-angle light, and one or more dimmable second light sources that emit low-angle light, into the lighted area. The system also includes a camera that captures images of the lighted area, and an controller that is (a) operable to identify one or more activity locations within the lighted area from the images, and (b) operatively coupled to dim one or more of the light sources that illuminate the one or more activity locations.Type: ApplicationFiled: April 23, 2014Publication date: October 30, 2014Applicant: GE LIGHTING SOLUTIONS, LLCInventors: Neil P. CANNON, Jeffrey BISBERG, John LEMBKE
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Publication number: 20140125213Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.Type: ApplicationFiled: March 13, 2013Publication date: May 8, 2014Applicant: Albeo Technologies, Inc.Inventors: Ming Kong, John Powell, Jeffrey Bisberg
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Publication number: 20130294060Abstract: An LED lighting element for use in a fluorescent lighting fixture includes first and second end caps formed as printed circuit boards for connecting with and obtaining physical support from respective first and second sockets of the fluorescent lighting fixture, and a blade supporting one or more LEDs between the first and second end caps. The blade includes a first compartment that contains high voltage circuitry, a second compartment, separated from the first compartment, that contains a low voltage assembly including the one or more LEDs, and a third compartment forming an optical cavity. The element also includes a power converter, located in one or both of the first and second end caps, that converts power from the fluorescent light socket into power for operating the LEDs.Type: ApplicationFiled: April 22, 2013Publication date: November 7, 2013Inventors: Peter Van Laanen, Jeffrey Bisberg, Neil Cannon, Tracy Earles
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Patent number: 8558255Abstract: A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.Type: GrantFiled: December 18, 2012Date of Patent: October 15, 2013Assignee: Albeo Technologies, Inc.Inventor: Jeffrey Bisberg
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Patent number: 8425085Abstract: An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.Type: GrantFiled: April 28, 2009Date of Patent: April 23, 2013Assignee: Albeo Technologies, Inc.Inventors: Peter Van Laanen, Jeffrey Bisberg, Neil Cannon, Tracy Earles
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Patent number: 8338197Abstract: A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.Type: GrantFiled: November 2, 2011Date of Patent: December 25, 2012Assignee: Albeo Technologies, Inc.Inventor: Jeffrey Bisberg
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Publication number: 20120313120Abstract: A method for depositing a phosphor layer on a light-emitting diode (“LED”) chip includes coating at least a light-emitting side of the LED chip with a phosphor-adhesive material, and applying phosphor particles to an exposed surface of the material such that the phosphor layer forms of phosphor particles that adhere to the exposed surface. A method for depositing phosphor layers on each of a plurality of LED chips includes mounting the LED chips to a common substrate, coating at least a light-emitting side of the LED chips with a phosphor-adhesive material, and applying phosphor particles to exposed surfaces of the material such that the phosphor layers form of phosphor particles that adhere to the material. A processed LED chip includes an unpackaged LED chip, a phosphor-adhesive material applied to a light-emitting side of the LED chip, and a phosphor layer formed of phosphor particles adhered to the material.Type: ApplicationFiled: June 8, 2012Publication date: December 13, 2012Inventor: Jeffrey Bisberg
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Publication number: 20120042512Abstract: A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.Type: ApplicationFiled: November 2, 2011Publication date: February 23, 2012Inventor: Jeffrey Bisberg
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Patent number: 8058659Abstract: Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.Type: GrantFiled: August 16, 2010Date of Patent: November 15, 2011Assignee: AlbEO Technologies, Inc.Inventor: Jeffrey Bisberg
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Patent number: D699886Type: GrantFiled: May 5, 2011Date of Patent: February 18, 2014Assignee: Albeo Technologies, Inc.Inventors: Christopher Wilke, Jeffrey Bisberg, Neil Cannon, Peter Van Lannen
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Patent number: D714486Type: GrantFiled: February 17, 2014Date of Patent: September 30, 2014Assignee: Albeo Technologies, Inc.Inventors: Christopher Wilke, Jeffrey Bisberg, Neil Cannon, Peter Van Laanen
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Patent number: D731103Type: GrantFiled: March 14, 2013Date of Patent: June 2, 2015Assignee: Albeo Technologies, Inc.Inventors: Christopher Wilke, Jeffrey Bisberg, Neil Cannon, Peter Van Laanen, Paul Winker, Andrew Wetzig
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Patent number: D774235Type: GrantFiled: April 22, 2015Date of Patent: December 13, 2016Assignee: ALBEO TECHNOLOGIES, INC.Inventors: Christopher Wilke, Jeffrey Bisberg, Neil Cannon, Peter Van Laanen, Paul Winker, Andrew Wetzig