Abstract: An improved TCM-like circuit module for cooling an array of chips mounted on a substrate. The substrate and the chips are enclosed by components that include a barrier plate that separates the chip space from a coolant such as air or chilled water. A floating plate contacts a heat transfer surface of each chip and forms a local heat sink. Pins conduct heat from the floating plate. In one embodiment, one end of each pin is rigidly attached to the floating plate and the other end is located in a cavity in the barrier plate. In a second embodiment, the cavities are formed in the floating plate and the barrier plate rigidly supports the pins. In the second embodiment, the pins can be extended through the barrier plate to contact the coolant directly.