Abstract: A technology for a prosthetic above-knee device is provided. A socket may be used to attach the device to a residual limb, and may have a rigid body coupled to the socket. The device may include a first link with a first link end coupled through the rigid body to the socket and a second link end coupled to the rigid body. The second link of the device may have a third link end attached to the rigid body, and a fourth link end coupled to a housing. The device may include a hydraulic cylinder with a piston and a hydraulic cylinder link coupled between the rigid body and the piston of the hydraulic cylinder. The stability adjustment nut may adjust a travel distance of the hydraulic cylinder link with respect to the hydraulic cylinder to provide an adjustment of an instant center for stability modification.

Abstract: A technology for a prosthetic above-knee device is provided. A socket may be used to attach the device to a residual limb, and may have a rigid body coupled to the socket. The device may include a first link with a first link end coupled through the rigid body to the socket and a second link end coupled to the rigid body. The second link of the device may have a third link end attached to the rigid body, and a fourth link end coupled to a housing. The device may include a hydraulic cylinder with a piston and a hydraulic cylinder link coupled between the rigid body and the piston of the hydraulic cylinder. The stability adjustment nut may adjust a travel distance of the hydraulic cylinder link with respect to the hydraulic cylinder to provide an adjustment of an instant center for stability modification.

Abstract: A system and method for extending the USB VBUS power signal. A system for extending the USB VBUS power signal includes at least one PCA board. The system includes a USB host. The USB host outputs a new power signal compliant with USB VBUS power signal requirements. The VBUS signal may be connected to a voltage converter to change the voltage level to a desired enable signal for the voltage supply at the receiving end of the system. The VBUS signal may be connected to logic to change the polarity of the enable signal. The enable signal is routed across traces on the one or more PCA boards. A voltage supply is located on a PCA board and receives the enable signal. The enable signal causes the voltage supply to output a new power signal that is compliant with USB VBUS power signal requirements.

Abstract: A system and method for extending the USB VBUS power signal. A system for extending the USB VBUS power signal includes at least one PCA board. The system includes a USB host. The USB host outputs a new power signal compliant with USB VBUS power signal requirements. The VBUS signal may be connected to a voltage converter to change the voltage level to a desired enable signal for the voltage supply at the receiving end of the system. The VBUS signal may be connected to logic to change the polarity of the enable signal. The enable signal is routed across traces on the one or more PCA boards. A voltage supply is located on a PCA board and receives the enable signal. The enable signal causes the voltage supply to output a new power signal that is compliant with USB VBUS power signal requirements.

Abstract: In one embodiment, a memory device comprises a first partition to divide the memory device into a first segment to hold a first data block and a second segment to hold a second data block, and a codeword in a single internal word of the memory device.

Abstract: In one embodiment, a memory device comprises a first partition to divide the memory device into a first segment to hold a first data block and a second segment to hold a second data block, and a codeword in a single internal word of the memory device.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.