Abstract: Gate-all-around integrated circuit structures having pre-spacer-deposition cut gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. The integrated circuit structure also includes a dielectric structure having a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.

Abstract: Gate-all-around integrated circuit structures having pre-spacer-deposition cut gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. The integrated circuit structure also includes a dielectric structure having a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.

Abstract: A folding chair includes front and rear supports that fold and/or retract into central beams to reduce the space occupied by the chair in a folded configuration. A backrest is coupled to the central beams with a hub that allows an angle of the backrest relative to the central beams to be selected and for the backrest to be folded flat relative to the central beams. One or more actuators and pin actuators may control the relative movements of the backrest, front support, rear support, and central beams.

Abstract: Techniques for classifying, using a deep learning model, histopathological whole slide images (WSIs) as comprising images of cancerous or non-cancerous tissue and/or as comprising images of cancerous tissue having a genetic mutation or not having a genetic mutation are described herein. The techniques include at least one processor configured to instantiate a container-based processing architecture to train and/or use the deep learning model to process and classify at least one WSI. In some embodiments, a treatment may be selected and administered based on a classification result obtained from the deep learning model.

Abstract: A redundant array of independent disks (RAID) module converted from a 2.5-inch specification to a 3.5-inch specification is characterized in that two 2.5-inch SATA hard disks are installed within a standard 3.5-inch SATA RAID module, so as to form a RAID having two hard disks or two stand-alone SATA hard disks for mounting the RAID module including two 2.5-inch hard disks within a 3.5-inch disk drive slot of a common computer housing, or any other devices that can receive a 3.5-inch disk drive.

Abstract: A redundant array of independent disks (RAID) module converted from a 2.5-inch specification to a 3.5-inch specification is characterized in that two 2.5-inch SATA hard disks are installed within a standard 3.5-inch SATA RAID module, so as to form a RAID having two hard disks or two stand-alone SATA hard disks for mounting the RAID module including two 2.5-inch hard disks within a 3.5-inch disk drive slot of a common computer housing, or any other devices that can receive a 3.5-inch disk drive.

Abstract: A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

Abstract: A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

Abstract: A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

Abstract: A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.