Abstract: A DRAM device includes a mode register that is programmed to select one of two modes for operating data bus terminals in the device. A timing circuit generates timing signals in synchronism with the clock signal that correspond to the selected mode. The timing signals are combined with read data signals to generate corresponding timed read data signals. These timed data signals and termination signals from the timing circuit are applied to pull-up and pull-down circuitry, which drive respective pull-up and pull-down transistors coupled to the data bus terminals. The transistors drive the data bus terminals to either a first or a second voltage if the first mode of operation is selected and to either a third or a fourth voltage if the second mode of operation is selected. Additionally, the pull-up and pull-down transistors bias the data bus terminals to respective voltages corresponding to the selected operating mode.

Abstract: A DRAM device includes a mode register that is programmed to select one of two modes for operating data bus terminals in the device. A timing circuit generates timing signals in synchronism with the clock signal that correspond to the selected mode. The timing signals are combined with read data signals to generate corresponding timed read data signals. These timed data signals and termination signals from the timing circuit are applied to pull-up and pull-down circuitry, which drive respective pull-up and pull-down transistors coupled to the data bus terminals. The transistors drive the data bus terminals to either a first or a second voltage if the first mode of operation is selected and to either a third or a fourth voltage if the second mode of operation is selected. Additionally, the pull-up and pull-down transistors bias the data bus terminals to respective voltages corresponding to the selected operating mode.

Abstract: A semiconductor device is disclosed. The device includes an integrated circuit chip having integral de-coupling capacitors on the chip backside. The de-coupling capacitors includes a metal layer in intimate contact with the semiconductor substrate of the integrated circuit, a dielectric layer and a second metal layer. The second metal layer is segmented to form multiple capacitors, and each capacitor is interconnected to power supplies of the chip. Interconnection to different integrated circuit packages is provided. A method of making the semiconductor device is also disclosed.