Abstract: Embodiments of a method of cold-forming a glass article are disclosed. In one or more embodiments, the method includes bending a glass sheet over the chuck such that a first major surface of the glass sheets conforms to a bending surface of the chuck. In one or more embodiments, the method includes adhering a frame to the second major surface of the glass sheet such that at least one spacer is positioned between the glass sheet and the frame.

Abstract: A glass container comprises a glass body comprising a first region under a compressive stress extending from a surface of the glass body to a depth of compression and a second region extending from the depth of compression into a thickness of the glass body, the second region being under a tensile stress. The glass container also includes a localized compressive stress region having a localized compressive stress extending from the surface to a localized depth of compression within the body. The localized depth of compression is greater than the depth of compression of the first region. The glass container also includes a crack re-direction region extending in a predetermined propagation direction, wherein the crack re-direction region possesses a higher tensile stress than the tensile stress in the second region in a sub-region of the crack re-direction region, the sub-region extending substantially perpendicular to the predetermined propagation direction.

Abstract: Embodiments of a method of cold-forming a glass article are disclosed. In one or more embodiments, the method includes bending a glass sheet over the chuck such that a first major surface of the glass sheets conforms to a bending surface of the chuck. In one or more embodiments, the method includes adhering a frame to the second major surface of the glass sheet such that at least one spacer is positioned between the glass sheet and the frame.

Abstract: A glass container comprises a glass body comprising a first region under a compressive stress extending from a surface of the glass body to a depth of compression and a second region extending from the depth of compression into a thickness of the glass body, the second region being under a tensile stress. The glass container also includes a localized compressive stress region having a localized compressive stress extending from the surface to a localized depth of compression within the body. The localized depth of compression is greater than the depth of compression of the first region. The glass container also includes a crack re-direction region extending in a predetermined propagation direction, wherein the crack re-direction region possesses a higher tensile stress than the tensile stress in the second region in a sub-region of the crack re-direction region, the sub-region extending substantially perpendicular to the predetermined propagation direction.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A thermally treated metal sheet or article as well as processes and systems for making the thermally treated sheet or article is provided. The process comprises heating and/or cooling the metal sheet by non contact thermal conduction for sufficiently long to provide a desired microstructure and mechanical properties. The process results in thermally treated metal sheets.

Abstract: A glass sheet thermally strengthened such that at the first major surface is under compressive stress; the sheet having an a characteristic 2D autocorrelation matrix c(x,y) given by c(x,y)=F?1(F(g)·F?(g)) where F is a 2D Fourier transform and ? represents a complex conjugate operation and g is a high pass filtered data array given by g(x,y)=F?1(F(f(1?F(h)) where h is a spatial 2D low pass filter array and f is a square data array of Shear 0 and Shear 45 data, taken over an area away from any birefringence edge effects on the sheet, wherein an autocorrelation peak maximum width of the matrix c(x,y) at 40% of peak height, for the c(x,y) matrices from both the Shear 0 and Shear 45 data, is between 1 and 5 mm.

Abstract: Method and apparatus are provided for the controlled transport of glass sheets (13) or glass ribbons (15) undergoing heating and/or cooling (e.g., thermal tempering) by conduction more than convection. The controlled transport is achieved by applying a gas-based force (17,19,21) to the glass sheet (13) or glass ribbon (15). The gas-based force (17,19,21) can move the glass sheet (13) or glass ribbon (15) in a desired direction and/or cause it to acquire a desired orientation. The gas-based force (17,19,21) can also cause the glass sheet (13) or glass ribbon (15) to retain a desired position and/or a desired orientation. The gas-based force (17,19,21) can be applied to the glass sheet (13) or glass ribbon (15) continuously or intermittently. Systems for transitioning a glass sheet (13) or a glass ribbon (15) between a heating zone (27) and a quench zone (31) are also discussed.

Abstract: A strengthened glass or glass ceramic sheet has a roughness of greater than 0.05 nm Ra and less than 0.08 nm Ra over an area of 10 ?m×10 ?m and has the property that, excluding areas within three sheet thicknesses of the outer edge surface of the sheet, the slope of a measured value of a thermally affected property of glass over distance along the first major surface of the sheet is higher bordering one or more lower-cooling-rate-effect-exhibiting areas on the first surface of the sheet than elsewhere on the first surface of the sheet, and at least one of said one or more areas has a shortest linear dimension, in a direction parallel to the first major surface, of less than 100000 ?m.

Abstract: A strengthened glass or glass ceramic sheet has a first major surface, a second major surface opposite the first major surface, an interior region between the first and second surfaces, an outer edge surface extending between the first and second major surfaces, and a thickness between the first major surface and the second major surfaces, wherein the sheet comprises a glass or glass ceramic and is thermally strengthened and wherein the first major surface has a roughness of more than 0.1 nm Ra and less than 500 nm Ra over an area of 10 ?m×10 ?m and wherein PP<0.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract: Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.