Abstract: An adhesive injection process for a Pi-joint assembly comprises the steps of: machining at least two ports into a female part of a Pi-joint assembly; inserting a filler into a gap between a male part and the female part; applying a sealant above the filler; creating a vacuum with a vacuum pump at one port; injecting an adhesive through another port; and drawing the adhesive towards the vacuum pump until the gap under the filler is completely filled with the adhesive. The adhesive injection process incorporates lean technologies that enable increased productivity during the assembly of a Pi-joint design using adhesive bonding. The adhesive injection process is suitable for, but not limited to, applications in the aerospace industry, such as the aircraft airframe assembly. The adhesive injection process may be used for the bonding of upper and lower skins to airframe structure as well as for structure-to-structure bonding.

Abstract: A self-locating feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more land extending above one of a front side and a back side of the substructure. The land includes an outer surface, a depth location control surface and an edge location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween, and one or more notch located in one of the pair of axially elongated leg.

Abstract: A minimum bond assurance feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more standoff extending above one of the lower side, the front side and the back side of the substructure. The standoff includes a space location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween. The channel of the member has a first channel side, a channel floor and a second channel side, wherein the space location control surface may contact the member maintaining a standoff distance between the one of the lower side, the front side and the back side of the substructure and corresponding one of the channel floor, the first channel side and the second channel side of the member. A method of assembling a pi-joint assembly of the present invention is also provided.