Abstract: Systems and methods are provided for handling sequence-dependent data as part of processing and/or analyzing large data sets in a distributed data processing environment. The distributed data processing environment can be suitable for handling data generated at a plurality of sites within a network of manufacturing sites. The systems and methods can allow for pre-processing of some values for sequence-dependent data. This can allow secondary aggregated values and/or secondary aggregated data sets to be generated from sequence-dependent data that can span multiple blocks or partitions. Pre-calculation of secondary aggregated values and/or secondary aggregated data sets for sequence-dependent data can allow the efficiencies of parallel or distributed computation to be at least partially retained while also allowing for desired processing of the sequence-dependent data.

Abstract: An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.

Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.

Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.

Abstract: A gas distribution apparatus is provided having a first reservoir with a first upstream end and a first downstream end and a second reservoir with a second upstream end and a second downstream end. A reservoir switch valve is in fluid communication with the first downstream end of the first reservoir and the second downstream end of the second reservoir. The reservoir switch valve operable to selectively couple the first reservoir to an outlet of the reservoir switch valve when in a first state, and couple the second reservoir to the outlet of the reservoir switch valve when in a second state. A plurality of proportional flow control valves are provided having inlets coupled in parallel to the outlet of the reservoir switch valve The plurality of proportional flow control valves have outlets configured to provide gas to a processing chamber.

Abstract: Implementations described herein provide a chamber lid assembly. In one embodiment, a chamber lid assembly includes a heater embedded in a dielectric body forming a boundary of a processing chamber, wherein the heater has one or more heating zones that are independently controlled.

Abstract: Embodiments of a substrate support for use in a processing chamber are provided herein. In some embodiments, a substrate support includes a pedestal having an upper surface configured to accommodate a lift pin, a first annular region near an edge of the pedestal, and a second annular region disposed between the first annular region and a center of the pedestal, wherein the pedestal includes a first plurality of holes extending from the upper surface at regular intervals along the first annular region and a second plurality of holes extending from the upper surface at regular intervals along the second annular region; and a non-metal ball comprising aluminum oxide disposed in each hole of the first plurality of holes and the second plurality of holes, wherein an upper surface of each of the non-metal balls is raised with respect to the upper surface of the pedestal to define a support surface.

Abstract: Implementations described herein provide a chamber lid assembly. In one embodiment, a chamber lid assembly includes a heater embedded in a dielectric body forming a boundary of a processing chamber, wherein the heater has one or more heating zones that are independently controlled.

Abstract: Systems and methods are provided for handling sequence-dependent data as part of processing and/or analyzing large data sets in a distributed data processing environment. The distributed data processing environment can be suitable for handling data generated at a plurality of sites within a network of manufacturing sites. The systems and methods can allow for pre-processing of some values for sequence-dependent data. This can allow secondary aggregated values and/or secondary aggregated data sets to be generated from sequence-dependent data that can span multiple blocks or partitions. Pre-calculation of secondary aggregated values and/or secondary aggregated data sets for sequence-dependent data can allow the efficiencies of parallel or distributed computation to be at least partially retained while also allowing for desired processing of the sequence-dependent data.

Abstract: The present disclosure generally relates to methods of and apparatuses for controlling a plasma sheath near a substrate edge. The apparatus includes an auxiliary electrode that may be positioned adjacent an electrostatic chuck. The auxiliary electrode is recursively fed from a power source using equal length and equal impedance feeds. The auxiliary electrode is vertically actuatable, and is tunable with respect to ground or other frequencies responsible for plasma generation. Methods of using the same are also provided.

Abstract: Embodiments of a capacitor assembly for coupling radio frequency (RF) and direct current (DC) power to an electrode and substrate support incorporating same are provided herein. In some embodiments, the capacitor assembly includes a first conductive plate to receive RF power from an RF power source, the first conductive plate including a central bore; at least one capacitor coupled to the first conductive plate and surrounding the central bore; and a second conductive plate electrically coupled to the first conductive plate via the at least one capacitor, the second conductive plate including an input tap to receive DC power from a DC power source and at least one output tap to couple the RF and DC power to an electrode.

Abstract: Embodiments of a capacitor assembly for coupling radio frequency (RF) and direct current (DC) power to an electrode and substrate support incorporating same are provided herein. In some embodiments, the capacitor assembly includes a first conductive plate to receive RF power from an RF power source, the first conductive plate including a central bore; at least one capacitor coupled to the first conductive plate and surrounding the central bore; and a second conductive plate electrically coupled to the first conductive plate via the at least one capacitor, the second conductive plate including an input tap to receive DC power from a DC power source and at least one output tap to couple the RF and DC power to an electrode.