Abstract: Catalysts comprising a Ta layer having an outer layer with a layer comprising Pt directly thereon, wherein the Ta layer has an average thickness in a range from 0.04 to 30 nanometers, wherein the layer comprising Pt has an average thickness in a range from 0.04 to 50 nanometers, and wherein the Pt and Ta are present in an atomic ratio in a range from 0.01:1 to 10:1. Catalyst described herein are useful, for example, in fuel cell membrane electrode assemblies.

Abstract: A rotorcraft including a rotor hub, a pitch housing moveable relative to the rotor hub about at least a feather axis and a flap axis, the pitch housing defining an internal volume, a bearing pin, the inboard end portion of the bearing pin being fixedly connected to the rotor hub, wherein the bearing pin defines the feather axis, a spherical bearing connected to the inboard end portion of the pitch housing and defining the flap axis, wherein the bearing pin extends through the spherical bearing, a rotor blade connected to the outboard end portion of the pitch housing, and a sensor assembly positioned in the internal volume and operatively connected to both the pitch housing and the outboard end portion of the bearing pin.

Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

Abstract: A rotorcraft including a rotor hub, a pitch housing moveable relative to the rotor hub about at least a feather axis and a flap axis, the pitch housing defining an internal volume, a bearing pin, the inboard end portion of the bearing pin being fixedly connected to the rotor hub, wherein the bearing pin defines the feather axis, a spherical bearing connected to the inboard end portion of the pitch housing and defining the flap axis, wherein the bearing pin extends through the spherical bearing, a rotor blade connected to the outboard end portion of the pitch housing, and a sensor assembly positioned in the internal volume and operatively connected to both the pitch housing and the outboard end portion of the bearing pin.

Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

Abstract: A tank system may include a tank having a tank volume and mounted in a vehicle having a system CG and a system CG offset limit. The tank system may further include at least one outer baffle having an outer baffle port and dividing the tank volume into an inner compartment and at least one outer compartment. The outer baffle may be positioned such that when the outer baffle port is open and the combined volume of liquid in the inner and outer compartment is less than a total inner compartment volume, the system CG may exceed the system CG offset limit during a shift of a liquid CG, and when the outer baffle port is closed and the outer compartment is substantially empty of liquid, the system CG remains within the system CG offset limit during a shift of the liquid CG for at least one fill level of the inner compartment.

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract: The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.

Abstract: An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures.

Abstract: An apparatus, system, and method that initialize a capacitive sensing switch and detects a pushed button are described. The apparatus comprises a keypad, a logic component, an initialization threshold, a measured capacitive value, and a processor. The keypad comprises at least one capacitive sensing switch. The logic component is configured to determine a capacitive sensing range for each capacitive sensing switch, wherein the range corresponds to the difference between the maximum and minimum capacitance. Each capacitive sensing switch is initialized when the capacitive sensing range exceeds the initialization threshold. The measured capacitive value measures the capacitive value for each switch and a corresponding push-button threshold determines whether the button has been pushed.

Abstract: A tank system may include a tank having a tank volume and mounted in a vehicle having a system CG and a system CG offset limit. The tank system may further include at least one outer baffle having an outer baffle port and dividing the tank volume into an inner compartment and at least one outer compartment. The outer baffle may be positioned such that when the outer baffle port is open and the combined volume of liquid in the inner and outer compartment is less than a total inner compartment volume, the system CG may exceed the system CG offset limit during a shift of a liquid CG, and when the outer baffle port is closed and the outer compartment is substantially empty of liquid, the system CG remains within the system CG offset limit during a shift of the liquid CG for at least one fill level of the inner compartment.

Abstract: A device under test (DUT) may be tested using a radio-frequency test station. The DUT may include at least one antenna, wireless communications circuitry associated with the antenna, and other peripheral components such as a camera module, a display module, and audio circuitry. The test station may include a shielded enclosure in which the DUT is placed during testing. The DUT need not be electrically wired to any test equipment. The DUT may be configured to operate in self test mode. The DUT may be configured to obtain baseline noise floor measurements while all the peripheral components are deactivated and may be configured to obtain elevated noise floor measurements while selectively activating desired subsets of the peripheral components. The difference between the elevated and baseline noise floor measurements may be computed to determine whether at least some of the peripheral components negatively impact the antenna performance by an excessive amount.

Abstract: A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield.

Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract: The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.

Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

Abstract: An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures.