Patents by Inventor Jeffrey O. York
Jeffrey O. York has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9545215Abstract: A method and system which includes a minimally invasive, implantable device with a sensor configured for collecting electrical data associated with cardiac performance, a sensor configured for collecting mechanical data associated with cardiac performance, a sensor for collecting optical data associated with cardiac performance, a sensor for collecting biochemical data associated with cardiac performance, and a processor for deriving cardiac conditions and actuating an alarm upon identifying a cardiac event.Type: GrantFiled: July 31, 2008Date of Patent: January 17, 2017Assignee: Medtronic, Inc.Inventors: Randal C. Schulhauser, John K. Day, Scott Wayne Haskin, Tho V. Huynh, Todd A. Kallmyer, Brian Bruce Lee, Jeffrey O. York, William Cope
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Patent number: 8639341Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: GrantFiled: August 9, 2013Date of Patent: January 28, 2014Assignee: Medtronic, Inc.Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K Yamamoto, Brad C Tischendorf, James D Reinke, Andrew J Thom, Thomas P Miltich, William John Taylor, Kenneth C Gardeski, Larry Earl Tyler, Jeffrey O York, Gordon O Munns
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Publication number: 20130325086Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: ApplicationFiled: August 9, 2013Publication date: December 5, 2013Applicant: Medtronic, Inc.Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
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Patent number: 8509899Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: GrantFiled: January 18, 2011Date of Patent: August 13, 2013Assignee: Medtronic, Inc.Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
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Patent number: 8216134Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.Type: GrantFiled: May 7, 2008Date of Patent: July 10, 2012Assignee: Medtronic, Inc.Inventors: Andrew J. Ries, Jeffrey O. York, Stephen R. Belcher, Jeffrey M. Jelen
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Publication number: 20120165902Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: ApplicationFiled: January 18, 2011Publication date: June 28, 2012Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
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Publication number: 20100030034Abstract: A method and system which includes a minimally invasive, implantable device with a sensor configured for collecting electrical data associated with cardiac performance, a sensor configured for collecting mechanical data associated with cardiac performance, a sensor for collecting optical data associated with cardiac performance, a sensor for collecting biochemical data associated with cardiac performance, and a processor for deriving cardiac conditions and actuating an alarm upon identifying a cardiac event.Type: ApplicationFiled: July 31, 2008Publication date: February 4, 2010Inventors: Randal C. Schulhauser, John K. Day, Scott Wayne Haskin, Tho V. Huynh, Todd A. Kallmyer, Brian Bruce Lee, Jeffrey O. York, William Cope
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Publication number: 20090156905Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.Type: ApplicationFiled: May 7, 2008Publication date: June 18, 2009Inventors: Andrew J. Ries, Jeffrey O. York, Stephen R. Belcher, Jeffrey M. Jelen