Patents by Inventor Jeffrey O. York

Jeffrey O. York has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9545215
    Abstract: A method and system which includes a minimally invasive, implantable device with a sensor configured for collecting electrical data associated with cardiac performance, a sensor configured for collecting mechanical data associated with cardiac performance, a sensor for collecting optical data associated with cardiac performance, a sensor for collecting biochemical data associated with cardiac performance, and a processor for deriving cardiac conditions and actuating an alarm upon identifying a cardiac event.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: January 17, 2017
    Assignee: Medtronic, Inc.
    Inventors: Randal C. Schulhauser, John K. Day, Scott Wayne Haskin, Tho V. Huynh, Todd A. Kallmyer, Brian Bruce Lee, Jeffrey O. York, William Cope
  • Patent number: 8639341
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: January 28, 2014
    Assignee: Medtronic, Inc.
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K Yamamoto, Brad C Tischendorf, James D Reinke, Andrew J Thom, Thomas P Miltich, William John Taylor, Kenneth C Gardeski, Larry Earl Tyler, Jeffrey O York, Gordon O Munns
  • Publication number: 20130325086
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Application
    Filed: August 9, 2013
    Publication date: December 5, 2013
    Applicant: Medtronic, Inc.
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
  • Patent number: 8509899
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: August 13, 2013
    Assignee: Medtronic, Inc.
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
  • Patent number: 8216134
    Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: July 10, 2012
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeffrey O. York, Stephen R. Belcher, Jeffrey M. Jelen
  • Publication number: 20120165902
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Application
    Filed: January 18, 2011
    Publication date: June 28, 2012
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
  • Publication number: 20100030034
    Abstract: A method and system which includes a minimally invasive, implantable device with a sensor configured for collecting electrical data associated with cardiac performance, a sensor configured for collecting mechanical data associated with cardiac performance, a sensor for collecting optical data associated with cardiac performance, a sensor for collecting biochemical data associated with cardiac performance, and a processor for deriving cardiac conditions and actuating an alarm upon identifying a cardiac event.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Inventors: Randal C. Schulhauser, John K. Day, Scott Wayne Haskin, Tho V. Huynh, Todd A. Kallmyer, Brian Bruce Lee, Jeffrey O. York, William Cope
  • Publication number: 20090156905
    Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.
    Type: Application
    Filed: May 7, 2008
    Publication date: June 18, 2009
    Inventors: Andrew J. Ries, Jeffrey O. York, Stephen R. Belcher, Jeffrey M. Jelen