Patents by Inventor Jeffrey R. Pollard

Jeffrey R. Pollard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12023937
    Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: July 2, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jacob M. Lum, Si-lam J. Choy, Jeffrey R. Pollard, Tsuyoshi Yamashita, Jeremy Sells, Garrett E. Clark
  • Patent number: 11654680
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: May 23, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-Iam Choy, Michael W. Cumbie, Chien-Hua Chen, Jeffrey R. Pollard
  • Publication number: 20230103786
    Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.
    Type: Application
    Filed: March 11, 2020
    Publication date: April 6, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jacob M. Lum, Si-lam J. Choy, Jeffrey R. Pollard, Tsuyoshi Yamashita, Jeremy Sells, Garrett E. Clark
  • Publication number: 20220143606
    Abstract: The present disclosure is drawn to microfluidic devices. The microfluidic device includes a substrate, an optically translucent lid, an adhesive securing the substrate to the lid, and an optical barrier material between the substrate and the optically translucent lid.
    Type: Application
    Filed: July 26, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Randall Orson Willard, Jeffrey R. Pollard, Alexander Govyadinov, Tod Woodford
  • Patent number: 11155086
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: October 26, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-Iam Choy, Michael W Cumbie, Chien-Hua Chen, Jeffrey R Pollard
  • Publication number: 20210291547
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-Iam Choy, Michael W. Cumbie, Chien-Hua Chen, Jeffrey R. Pollard
  • Patent number: 11065883
    Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: July 20, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Jeffrey R. Pollard, Michael W. Cumbie, Si-Lam Choy
  • Patent number: 11059291
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an army of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an army of enclosed cross-channels. Each enclosed cross-channel of the army of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: July 13, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-lam Choy, Michael W Cumbie, Chien-Hua Chen, Jeffrey R Pollard
  • Publication number: 20210129534
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
    Type: Application
    Filed: July 31, 2017
    Publication date: May 6, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-lam Choy, Michael W Cumbie, Chien-Hua Chen, Jeffrey R Pollard
  • Publication number: 20200282738
    Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.
    Type: Application
    Filed: November 27, 2017
    Publication date: September 10, 2020
    Inventors: Chien-Hua Chen, Jeffrey R. Pollard, Michael W. Cumbie, Si-La in Choy
  • Publication number: 20200164647
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
    Type: Application
    Filed: July 31, 2017
    Publication date: May 28, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-lam Choy, Michael W Cumbie, Chien-Hua Chen, Jeffrey R Pollard
  • Patent number: 9266326
    Abstract: In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10 nm at the bonding interface with the membrane.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: February 23, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Elmer Abbott, Jr., Chien-Hua Chen, Jeffrey R. Pollard
  • Publication number: 20150138276
    Abstract: In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10 nm at the bonding interface with the membrane.
    Type: Application
    Filed: July 25, 2012
    Publication date: May 21, 2015
    Inventors: James Elmer Abbott, JR., Chien-Hua Chen, Jeffrey R. Pollard
  • Patent number: 9021699
    Abstract: Electromagnetic radiation is transmitted through a piezoelectric material and is absorbed in at least an adhesive that bonds the piezoelectric material to another material. Absorbing the electromagnetic radiation in the adhesive ablates the adhesive and the ablation of the adhesive acts to remove the piezoelectric material.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: May 5, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Jeffrey R. Pollard
  • Patent number: 8939556
    Abstract: A fluid ejection device includes a flexible membrane, an adhesive layer, a piezoelectric material layer, and first and second electrically conductive layers. The adhesive layer and the piezoelectric material layer include edge regions and central regions. A surface of the edge region of the piezoelectric material layer is coplanar with a surface of the edge region of the adhesive layer. The first electrically conductive layer is between the piezoelectric material layer and the adhesive layer such that a surface of the first electrically conductive layer is coplanar with the surface of the edge region of the piezoelectric material layer and the surface of the edge region of the adhesive layer. The second electrically conductive layer is over the surface of the edge region of the piezoelectric material layer, the surface of the edge region of the adhesive layer, the surface of the first electrically conductive layer, and the flexible membrane.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 27, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey R. Pollard, Tsuyoshi Yamashita
  • Patent number: 8348396
    Abstract: A fluid ejection device includes a flexible membrane and an adhesive layer on the flexible membrane. The adhesive layer includes a first region and a second region extending from the first region. The fluid ejection device includes a piezoelectric material layer including an edge region and a central region. A surface of the edge region of the piezoelectric material layer is substantially coplanar with a surface of the second region of the adhesive layer. The surface of the edge region and the surface of the second region are substantially parallel with the flexible membrane.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: January 8, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Jeffrey R. Pollard
  • Publication number: 20120314005
    Abstract: A fluid ejection device includes a flexible membrane and an adhesive layer on the flexible membrane. The adhesive layer includes a first region and a second region extending from the first region. The fluid ejection device includes a piezoelectric material layer including an edge region and a central region. A surface of the edge region of the piezoelectric material layer is substantially coplanar with a surface of the second region of the adhesive layer. The surface of the edge region and the surface of the second region are substantially parallel with the flexible membrane.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 13, 2012
    Inventor: Jeffrey R. Pollard
  • Publication number: 20120314006
    Abstract: A fluid ejection device includes a flexible membrane and an adhesive layer on the flexible membrane. The adhesive layer includes a first region and a second region extending from the first region. The fluid ejection device includes a piezoelectric material layer including an edge region and a central region. A surface of the edge region of the piezoelectric material layer is substantially coplanar with a surface of the second region of the adhesive layer. The surface of the edge region and the surface of the second region are substantially parallel with the flexible membrane.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 13, 2012
    Inventor: Jeffrey R. Pollard
  • Publication number: 20110168807
    Abstract: Electromagnetic radiation is transmitted through a piezoelectric material and is absorbed in at least an adhesive that bonds the piezoelectric material to another material. Absorbing the electromagnetic radiation in the adhesive ablates the adhesive and the ablation of the adhesive acts to remove the piezoelectric material.
    Type: Application
    Filed: September 23, 2008
    Publication date: July 14, 2011
    Inventor: Jeffrey R. Pollard
  • Patent number: 7893386
    Abstract: The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: February 22, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Charles Otis, Mehrgan Khavari, Jeffrey R. Pollard, Mark C. Huth