Abstract: A method of adhesively bonding an adhesive coated, semi-rigid film to a substrate is reported. The method utilizes at least two alignment tools that are each positioned to substantially contact the surface of a substrate at an outer edge of the substrate. The adhesive-coated, semi-rigid film is then interposed between the first and the second alignment tools and the adhesive is brought into contact with the major surface of the substrate. The semi-rigid film is then aligned by contacting a first side edge of the semi-rigid film with a major surface of a first alignment tool and contacting a second side edge of the semi-rigid film with a major surface of a second alignment tool such that the film is aligned relative to the edge of the substrate. After alignment, pressure is applied to at least a portion of the surface area of the first side of the semi-rigid film to effectuate adhesive bonding of the film to the major surface of the substrate.