Patents by Inventor Jeffrey Sloane

Jeffrey Sloane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRAL HEATER ASSEMBLY AND METHOD FOR HOST BOARD OF ELECTRONIC PACKAGE ASSEMBLY
    Publication number: 20150373886
    Abstract: A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface.
    Type: Application
    Filed: August 28, 2015
    Publication date: December 24, 2015
    Inventor: Jeffrey Sloane
  • Integral heater assembly and method for carrier or host board of electronic package assembly
    Patent number: 9125301
    Abstract: A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 1, 2015
    Assignee: Integrated Microwave Corporation
    Inventor: Jeffrey Sloane
  • INTEGRAL HEATER ASSEMBLY AND METHOD FOR CARRIER OR HOST BOARD OF ELECTRONIC PACKAGE ASSEMBLY
    Publication number: 20130094148
    Abstract: A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface.
    Type: Application
    Filed: October 18, 2011
    Publication date: April 18, 2013
    Applicant: INTEGRATED MICROWAVE CORPORATION
    Inventor: Jeffrey Sloane