Abstract: A semiconductor device includes a cell array having tracks and rows formed on a substrate. The tracks extend perpendicularly to the rows. A logic cell is formed across two adjacent rows within the cell array. The logic cell includes a cross-couple (XC) in each row and a plurality of poly tracks across the two adjacent rows. Each XC includes two cross-coupled complementary field-effect-transistors. Each poly track is configured to function as an inter-row gate for the XCs. A pair of signal tracks is positioned on opposing boundaries of the logic cell and electrically coupled to the plurality of poly tracks.

Abstract: A semiconductor device includes a first field-effect transistor positioned over a substrate, a second field-effect transistor stacked over the first field-effect transistor, a third field-effect transistor stacked over the second field-effect transistor, and a fourth field-effect transistor stacked over the third field-effect transistor. A bottom gate structure is disposed around a first channel structure of the first field-effect transistor and positioned over the substrate. An intermediate gate structure is disposed over the bottom gate structure and around a second channel structure of the second field-effect transistor and a third channel structure of the third field-effect transistor. A top gate structure is disposed over the intermediate gate structure and around a fourth channel structure of the fourth field-effect transistor.

Abstract: An arrow golf system has a bow having a bowstring, an arrow having a shaft with a ball on one end with a fletching and a string nock on an opposite end, a starting location, a finishing location, and a capturing apparatus at the finishing location. A player shoots the arrow from the starting location with the bow, to a second location closer to the finishing location, retrieves the arrow at the second location, and shoots the arrow toward the capturing apparatus from the second location.

Abstract: A semiconductor device includes a first pair of transistors over a substrate. The first pair of transistors includes a first transistor having a first gate structure over the substrate and a second transistor having a second gate structure stacked over the first transistor. A second pair of transistors is stacked over the first pair of transistors, resulting in a vertical stack perpendicular to a working surface of the substrate. The second pair of transistors includes a third transistor having a third gate structure stacked over the second transistor and a fourth transistor having a fourth gate structure stacked over the third transistor. The third gate structure extends from a central region of the vertical stack to a first side of the vertical stack. The second gate structure and the fourth gate structure extend from the central region to a second side of the vertical stack opposite the first side.

Abstract: Aspects of the present disclosure provide a multi-tier semiconductor structure. For example, the multi-tier semiconductor structure can include a lower semiconductor device tier, and a lower signal wiring structure electrically connected to the lower semiconductor device tier. The multi-tier semiconductor structure can further include a primary power delivery network (PDN) structure disposed over the lower semiconductor device tier and the lower signal wiring structure and electrically connected to the lower semiconductor device tier. The multi-tier semiconductor structure can further include an upper semiconductor device tier disposed over and electrically connected the first PDN structure, and an upper signal wiring structure disposed over the primary PDN structure and electrically connected to the upper semiconductor device tier.

Abstract: Aspects of the present disclosure provide a multi-tier semiconductor structure. For example, the multi-tier semiconductor structure can include a first power delivery network (PDN) structure, and a first semiconductor device tier disposed over and electrically connected to the first PDN structure. The multi-tier semiconductor structure can further include a signal wiring tier disposed over and electrically connected to the first semiconductor device tier, a second semiconductor device tier disposed over and electrically connected to the signal wiring tier, and a second PDN structure disposed over and electrically connected to the second semiconductor device tier. The multi-tier semiconductor structure can further include a through-silicon via (TSV) structure electrically connected to the signal wiring tier, wherein the TSV structure penetrates the second PDN structure.

Abstract: A semiconductor device includes a device plane including an array of cells each including a transistor device. The device plane is formed on a working surface of a substrate and has a front side and a backside opposite the front side. A signal wiring structure is formed on the front side of the device plane. A front-side power distribution network (FSPDN) is positioned on the front side of the device plane. A buried power rail (BPR) is disposed below the device plane on the backside of the device plane. A power tap structure is formed in the device plane. The power tap structure electrically connects the BPR to the FSPDN and electrically connects the BPR to at least one of the transistor devices to provide power to the at least one of the transistor devices.

Abstract: A semiconductor device includes a first device plane over a substrate. The first device plane includes a first transistor device having a first source/drain (S/D) region formed in an S/D channel. A second device plane is formed over the first device plane. The second device plane includes a second transistor device having a second gate formed in a gate channel which is adjacent to the S/D channel. A first inter-level connection is formed from the first S/D region of the first transistor device to the second gate of the second transistor device. The first inter-level connection includes a lateral offset from the S/D channel to the gate channel.

Abstract: Provided are compounds of Formula (II) that enhance the efficacy of viruses by increasing spread of the virus in cells, increasing the titer of virus in cells, or increasing the antigen expression from a virus, gene or trans-gene expression from a virus, or virus protein expression in cells. Other uses, compositions and methods of using same are also provided.

Abstract: A semiconductor device includes dielectric layers and local interconnects that are stacked over a substrate alternatively, and extend along a top surface of the substrate laterally. Sidewalls of the dielectric layers and sidewalls of the local interconnects have a staircase configuration. The local interconnects are spaced apart from each other by dielectric layers and have uncovered portions by the dielectric layers. The semiconductor device also includes conductive layers selectively positioned over the uncovered portions of the local interconnects, where sidewalls of the conductive layers and sidewalls of the local interconnects are coplanar. The semiconductor device further includes isolation caps that extend from the dielectric layers. The isolation caps are positioned along sidewalls of the conductive layers and sidewalls of the local interconnects so as to separate the conductive layers from one another.

Abstract: A method for microfabrication of a three dimensional transistor stack having gate-all-around field-effect transistor devices. The channels hang between source/drain regions. Each channel is selectively deposited with layers of materials designed for adjusting the threshold voltage of the channel. The layers may be oxides, high-k materials, work function materials and metallization. The three dimensional transistor stack forms an array of high threshold voltage devices and low threshold voltage devices in a single package.

Abstract: A method of fabricating a semiconductor device is provided. The method includes forming BPR structures filled with a replacement BPR material, first S/D structures, first replacement silicide layers, and a pre-metallization dielectric that covers the first replacement silicide layers and the first S/D structures. The method also includes forming first interconnect openings in the pre-metallization dielectric and first replacement interconnect layers in the first interconnect openings. The first replacement interconnect layers are connected to the first replacement silicide layers. A thermal process is executed. The method further includes replacing, from a first side of the first wafer, a first group of the first replacement interconnect layers, a first group of the first replacement silicide layers, and the replacement BPR material, and replacing, from a second side of the first wafer, a second group of the first replacement interconnect layers, and a second group of the first replacement silicide layers.

Abstract: A surgical tissue connector system for moving a first internal body tissue to a position away from a second internal body tissue and then holding the first internal body tissue in the position. Tissue connectors are secured to cords such that the length of cord between the tissue connectors can be easily adjusted in a laparoscopic work space.

Abstract: In method for forming a semiconductor device, a first opening is formed in a dielectric stack that has a cylinder shape with a first sidewall. A first conductive layer is deposited along the first sidewall of the first opening and a first insulating layer is deposited along an inner sidewall of the first conductive layer. The dielectric stack is then etched along an inner sidewall of the first insulating layer so as to form a second opening that extends into the dielectric stack with a second sidewall. A second conductive layer is further formed along the second sidewall of the second opening and a second insulating layer is formed along an inner sidewall of the second conductive layer. A bottom of the second conductive layer is positioned below a bottom of the first conductive layer to form a staggered configuration.

Abstract: Techniques herein include methods for fabricating CFET devices. The methods enable high-temperature processes to be performed for FINFET and gate all around (GAA) technologies without degradation of temperature sensitive materials within the device and transistors. In particular, high temperature anneals and depositions can be performed prior to deposition of temperature-sensitive materials, such as work function metals and silicides. The methods enable at least two transistor devices to be fabricated in a stepwise manner while preventing thermal violations of any materials in either transistor.

Abstract: A medical device includes a clevis, a first blade, a second blade, and a tension member. The first and second blades are rotatably coupled to the clevis. The first blade includes a first coupling portion. The tension member is coupled to the first blade and applies a torque to the first blade to rotate the first blade about the clevis between a first, second, and third orientation. The second blade includes a second coupling portion. The second coupling portion is coupled to the first coupling portion such that A) the second blade remains in a fixed position relative to the clevis when the first blade is between the first and second orientation, and B) rotation of the first retractor blade between the second and third orientation transfers at least a portion of the torque to the second retractor blade causing rotation of the second blade about the clevis.

Abstract: A urinal assembly having a frame and a plurality of posts or posts extending from the frame. The frame can include a plurality of openings. The openings can be defined by a plurality of sides and corners. The posts can extend from the corners and/or from the sides of the openings. In some embodiments, posts extend from a first face and a second face of the frame.

Abstract: A static random access memory (SRAM) structure is provided. The structure includes a plurality of SRAM bit cells on a substrate. Each SRAM bit cell includes at least six transistors including at least two NMOS transistors and at least two PMOS transistors. Each of the at least six transistors being lateral transistors with channels formed from nano-sheets grown by epitaxy. The at least six transistors positioned in two decks in which a second deck is positioned vertically above a first deck relative to a working surface of the substrate, wherein at least one NMOS transistor and at least one PMOS transistor share a common vertical gate. A first inverter formed using a first transistor positioned in the first deck and a second transistor positioned in the second deck. A second inverter formed using a third transistor positioned in the first deck and a fourth transistor positioned in the second deck. A pass gate is located in either the first deck or the second deck.

Abstract: An additional set of interconnects is created in bulk material, allowing connections to active devices to be made from both above and below. The interconnects below the active devices can form a power distribution network, and the interconnects above the active devices can form a signaling network. Various accommodations can be made to suit different applications, such as encapsulating buried elements, using sacrificial material, and replacing the bulk material with a dielectric. Epitaxial material can be used throughout the formation process, allowing for the creation of a monolithic substrate.

Abstract: In vertically stacked device structures, a buried interconnect and bottom contacts can be formed, thereby allowing connections to be made to device terminals from both below and above the stacked device structures. Techniques herein include a structure that enables electrical access to each independent device terminal of multiple devices, stacked on top of each other, without interfering with other devices and the local connections that are needed.