Patents by Inventor Jeffry S. Bennin
Jeffry S. Bennin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7218481Abstract: Apparatus and method for selectively applying a voltage to one major surface of a pair of piezoelectric motors (PZTs) on a disk drive head suspension with a primary plane of a load beam of the head suspension parallel to the major surfaces of the PZT elements electrically insulated from the load beam. Electrical connections to the PZTs are made via wires, solder, conductive epoxy or electro-mechanical attachment of a plated surface of the PZT with a bond pad on an electrically isolated substrate. Lead extensions or separate pieces may be used to connect to the PZTs. The PZTs may be located on a major surface of the load beam, or may be assembled in a pre-fabricated motor assembly before being installed in the head suspension. Apertures in the load beam and other layers permit physical installation of the PZT motors and enable electrical connection to the PZTs.Type: GrantFiled: October 7, 2003Date of Patent: May 15, 2007Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Scott C. Giere, Jason S. Griesbach, Brett L. Haugen, Jason R. Heffelfinger, Dennis M. Ingle, Tony S. Peterson
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Patent number: 7177119Abstract: A microactuated head suspension including a mounting region for attachment of the head suspension to a source of primary actuation, a pair of generally arcuate ring springs and a connecting member. The ring springs at spaced locations extending from the mounting region with at least one aperture interposed between the pair of ring springs. Each ring spring having concave sides that are substantially free from linear sections and are oriented away from a longitudinal centerline of the head suspension. The connection member is located opposite the mounting region and is spaced from the mounting region by the at least one aperture. The connection member joins ends of the pair of ring springs. In addition, the head suspension may include at least one microactuator for secondary actuation of the head suspension. The microactuator is operationally mounted relative to the pair of ring springs.Type: GrantFiled: December 5, 2001Date of Patent: February 13, 2007Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Wade A. Linnertz, Jason R. Heffelfinger
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Patent number: 7170716Abstract: A method of making a multi-piece head suspension for a rigid disk drive. The method includes providing a first layer including a mounting region with an integral boss tower attached to a stiffener by one or more positioning tabs; attaching a second layer including a spring region to an interface between the mounting region and the stiffener; attaching a flexure to the stiffener; and removing the positioning tabs. The flexure can optionally be a portion of the second layer.Type: GrantFiled: January 30, 2004Date of Patent: January 30, 2007Assignee: Hutchinson Technology IncorporatedInventors: Shane J. Van Sloun, Mark R. Christianson, Stevenson J. Marek, James R. Mahoney, Mark A. Schmidt, Brandon K. Fraser, Jeffry S. Bennin
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Publication number: 20040181934Abstract: A method of making a multi-piece head suspension for a rigid disk drive. The method includes providing a first layer including a mounting region with an integral boss tower attached to a stiffener by one or more positioning tabs; attaching a second layer including a spring region to an interface between the mounting region and the stiffener; attaching a flexure to the stiffener; and removing the positioning tabs. The flexure can optionally be a portion of the second layer.Type: ApplicationFiled: January 30, 2004Publication date: September 23, 2004Applicant: Hutchinson Technology IncorporatedInventors: Shane J. Van Sloun, Mark R. Christianson, Stevenson J. Marek, James R. Mahoney, Mark A. Schmidt, Brandon K. Fraser, Jeffry S. Bennin
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Patent number: 6728072Abstract: A head suspension assembly in a rigid disk drive having a load beam with a mounting region, a rigid region and a spring region located between the mounting region and rigid region. The mounting region includes an integral boss tower having attachment features. A method of making a multi-piece head suspension for a rigid disk drive is also disclosed. The method includes providing a first layer including a mounting region with an integral boss tower attached to a stiffener by one or more positioning tabs; attaching a second layer including a spring region to an interface between the mounting region and the stiffener; attaching a flexure to the stiffener; and removing the positioning tabs. The flexure can optionally be a portion of the second layer.Type: GrantFiled: March 6, 2002Date of Patent: April 27, 2004Assignee: Hutchinson Technology, Inc.Inventors: Shane J. Van Sloun, Mark R. Christianson, Stevenson J. Marek, James R. Mahoney, Mark A. Schmidt, Brandon K. Fraser, Jeffry S. Bennin
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Patent number: 6612016Abstract: A method of forming a flexure for an integrated lead head suspension with a metal spring layer, a conductive lead layer and an insulator layer between the metal spring layer and the conductive lead layer. The method includes forming insulator suspended portions on a lower surface of the conductive lead layer and further includes forming insulator spring arm portions on an upper surface of the metal spring layer adjacent to the insulator suspended portions.Type: GrantFiled: December 20, 2001Date of Patent: September 2, 2003Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd W. Boucher, Anthony J. Liberko, Raymond A. Loehlein, Robert J. Matz, Gabriel M. Montes, Karupanan Supramaniam
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Patent number: 6587310Abstract: A trace interconnect assembly designed for transmitting electrical signals to and from a head assembly in a hard disk drive is disclosed. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.Type: GrantFiled: June 6, 2000Date of Patent: July 1, 2003Assignee: Hutchinson Technology, Inc.Inventors: Jeffry S. Bennin, Todd Boucher, Jeffrey W. Green, Gary E. Gustafson, Ryan Jurgenson, Brent D. Lien
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Patent number: 6381100Abstract: A flexure for an integrated lead head suspension comprising a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having lead base region portions extending over the metal base region and lead suspended portions spaced from and adjacent to at least one of the metal spring arms. The flexure further includes an insulator layer between the metal spring layer and the conductive lead layer that has insulator base region portions for bonding the lead base region portions to and insulating the lead base region portions from the metal base region. The insulator layer also has insulator suspended portions on a lower surface of the lead suspended portions and insulator spring arm portions on an upper surface of the metal spring arms adjacent to the lead suspended portions.Type: GrantFiled: December 18, 1997Date of Patent: April 30, 2002Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd W. Boucher, Anthony J. Liberko, Raymond A. Loehlein, Robert J. Matz, Gabriel M. Montes, Karupanan Supramaniam
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Patent number: 6134075Abstract: A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.Type: GrantFiled: July 2, 1996Date of Patent: October 17, 2000Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd Boucher, Jeffrey W. Green, Gary E. Gustafson, Ryan Jurgenson, Brent D. Lien
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Patent number: 5982584Abstract: An integrated lead suspension flexure including a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having a surface facing the metal spring layer and extending between the metal base region and the metal head bonding platform. The conductive lead layer has lead base region portions extending over the metal base region, lead metal-backed arm portions extending over the metal spring arms, and lead suspended portions extending from at least one of the lead metal-backed arm portions.Type: GrantFiled: December 18, 1997Date of Patent: November 9, 1999Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd W. Boucher, Anthony J. Liberko, Raymond A. Loehlein, Robert J. Matz, Gabriel M. Montes, Karupanan Supramaniam
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Patent number: 5933293Abstract: A head suspension for use in a dynamic storage device includes a load beam combined with an electrical interconnect assembly, wherein a slider bond pad is supported within an aperture of the load beam by conductive integrated leads that form at least a part of a gimbal ring, and an anchor plate is connected to only a part of the leads within the gimbal ring. Preferably plural anchor plates are provided at spaced locations around a complete gimbal ring, and the lead portions spanning between the anchor plates provide clearance to facilitate portions of the head slider during pitch and roll movements.Type: GrantFiled: June 25, 1997Date of Patent: August 3, 1999Assignee: Hutchinson Technology, Inc.Inventor: Jeffry S. Bennin
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Patent number: 5883758Abstract: A lead structure adapted for attachment to a metal disk drive head suspension of the type having a mounting region on a proximal end, a head-receiving flexure on a distal end, a rigid region and a spring region between the rigid region and the mounting region. The lead structure is formed from a laminated sheet of material and includes a copper conductor layer and a stainless steel base layer bonded together by a polyimide insulating layer. The conductor layer includes a plurality of transversely spaced, elongate electrical conductors adapted to extend between the flexure and mounting region of the head suspension. The metal base layer includes flexure mounting, rigid region mounting and mounting region mounting sections having tabs which are adapted to be welded to the head suspension. At least portions of the conductor layer which traverse the flexure and spring regions of the head suspension are free from the metal base layer.Type: GrantFiled: August 6, 1997Date of Patent: March 16, 1999Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Ryan A. Jurgenson
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Patent number: 5864445Abstract: An integrated lead disk drive suspension including a load beam and one or more conductive leads. The load beam has a mounting region on a proximal end, a head bonding platform on a distal end, and one or more spring regions connecting the head bonding platform to the mounting region. The conductive leads are integrated with and insulated from the load beam by an adhesive dielectric layer, and extend between the head bonding platform and the mounting region. The leads are adapted to reduce mechanical effects of the leads and/or dielectric layer on spring characteristics of the spring regions. One embodiment of the leads includes at least a first compensating portion which extends off the load beam and traverses a nonlinear path around at least a portion of one or more of the spring regions. In another embodiment the portions of the conductive leads extending between the distal end of the load beam and the head bonding platform are substantially free from the dielectric layer.Type: GrantFiled: December 20, 1996Date of Patent: January 26, 1999Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd W. Boucher, James H. Dettmann, Lloyd C. Goss, Gary E. Gustafson, Michael T. Hofflander, Brent D. Lien, Dean E. Myers
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Patent number: 5844751Abstract: Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.Type: GrantFiled: April 19, 1996Date of Patent: December 1, 1998Assignee: Hutchinson Technology, IncorporatedInventors: Jeffry S. Bennin, Todd W. Boucher, James H. Dettmann, Lloyd C. Goss, Gary E. Gustafson, Michael T. Hofflander, Brent D. Lien, Dean E. Myers
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Patent number: 5839193Abstract: Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.Type: GrantFiled: May 25, 1994Date of Patent: November 24, 1998Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd W. Boucher, James H. Dettmann, Lloyd C. Goss, Gary E. Gustafson, Michael T. Hofflander, Brent D. Lien, Dean E. Myers
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Patent number: 5835306Abstract: A head suspension for attachment to an actuator arm and for supporting a head slider within a rigid disk drive includes a load beam having a gimbal region provided adjacent a distal end of the load beam with a slider receiving aperture. A slider bond pad separately provided from the load beam is supported within the aperture by at least one conductive trace that also connects the slider bond pad to the load beam. An end portion of the conductive trace defines a gimbal axis about which the slider bond pad can rotate, and the slider bond pad is connected to the end portion of the conductive trace so that the majority of the slider bond pad is located to one side of the gimbal axis.Type: GrantFiled: June 7, 1995Date of Patent: November 10, 1998Assignee: Hutchinson Technology IncorporatedInventor: Jeffry S. Bennin
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Patent number: 5748409Abstract: In a suspension assembly for a disk drive, a welding isolation structure for creating an isolated weld point and for substantially eliminating undesirable propagation of welding stresses during the welding of elements of the suspension assembly. The welding isolation structure is placed on selected locations on suspension assembly elements. The isolation structure includes a welding area, at least one isolation slot including a through aperture delineating at least a portion of the perimeter of the welding area, and at least one junction tab bridging the isolation slot and connecting the welding area to the remainder of the load beam. The isolation slots are designed to substantially relieve and contain welding stresses. In the suspension assembly, the tabs of each weld point are oriented generally in directions other than towards other weld points, such that additive and uneven propagation of welding stresses is prevented.Type: GrantFiled: March 19, 1997Date of Patent: May 5, 1998Assignee: Hutchinson Technology IncorporatedInventors: Mark T. Girard, Jeffry S. Bennin, David A. Ziegler
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Patent number: 5687479Abstract: A trace interconnect assembly for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.Type: GrantFiled: April 19, 1996Date of Patent: November 18, 1997Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd Boucher, Jeffrey W. Green, Gary E. Gustafson, Ryan Jurgenson, Brent D. Lien
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Patent number: 5645735Abstract: A method for manufacturing a head suspension including separately manufacturing a load beam and a set of traces. The traces are formed from a sheet of conductive material and include an elongated conductor portion and a gimbal portion. Portions of the traces which are configured to be mounted to the load beam are coated with dielectric before being mounted to the load beam. The gimbal portion of the traces provides both mechanical and electrical connections to the conductor portion.Type: GrantFiled: October 31, 1995Date of Patent: July 8, 1997Assignee: Hutchinson Technology IncorporatedInventors: Jeffry S. Bennin, Todd Boucher, Jeffrey W. Green, Gary E. Gustafson, Ryan Jurgenson, Brent D. Lien
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Patent number: 5598307Abstract: A magnetic read write head suspension with integrated lead traces on the load beam act as the longitudinal support arms for a cross bar and tongue of a T flexure or Watrous type flexure.Type: GrantFiled: June 7, 1995Date of Patent: January 28, 1997Assignee: Hutchinson Technology Inc.Inventor: Jeffry S. Bennin