Abstract: There is disclosed a semiconductor memory device that has a memory-cell array with memory cells arranged in a matrix, bit-line sense amplifiers connected to bit lines of the memory-cell array, a row address predecoder performing decoding of some of row address signals in response to a system clock, and a plurality of banks having an output line of the row address predecoder in common, includes: a row strobe buffer connected to an external system and producing a first control signal for selecting corresponding banks in response to the system clock, a row address strobe signal, and a bank selection address signal and for controlling generation of a row address sampling control signal; a row address sampling control signal generating circuit producing the row address sampling control signal in a predetermined period of time in response to generation of the first control signal produced by the row strobe buffer in order to control word-line activating and precharging operations; and a row decoder latching an outp

Abstract: There is disclosed a semiconductor memory device that has a memory-cell array with memory cells arranged in a matrix, bit-line sense amplifiers connected to bit lines of the memory-cell array, a row address predecoder performing decoding of some of row address signals in response to a system clock, and a plurality of banks having an output line of the row address predecoder in common, includes: a row strobe buffer connected to an external system and producing a first control signal for selecting corresponding banks in response to the system clock, a row address strobe signal, and a bank selection address signal and for controlling generation of a row address sampling control signal; a row address sampling control signal generating circuit producing the row address sampling control signal in a predetermined period of time in response to generation of the first control signal produced by the row strobe buffer in order to control word-line activating and precharging operations; and a row decoder latching an outp

Abstract: A standby current detecting circuit for use in a semiconductor memory device and method thereof are described. The memory device has a plurality of memory cells arranged at crossing points of a plurality of word lines and a plurality of bit lines. A plurality of switches are associated with each memory cell. A current path supplies current to each memory cell through the switch associated with each memory cell. A plurality of decoders are provided with each decoder for detecting a standby current supplied on one such current path for the memory cell. Each decoder includes control logic for selectively opening and isolating the switch associated with the memory cell in a standby current detection mode.

Abstract: A data in/out channel control circuit for a semiconductor memory device with multi-bank structure includes a plurality of split banks each provided with memory cell arrays, each split bank having a plurality of bit line pairs and a sub in/out line pair connected through a column selection transistor pair, for efficiently connecting data from the bit line pairs to a global in/out line pair. The circuit enables transmission of only the data in a given block bank through the global in/out line pair and the sub in/out line pairs with bank selection information and block selection information.

Abstract: A voltage control circuit is used to control the voltage levels on input and output lines of a semiconductor memory device. A load transistor is controlled by feeding back an output voltage of the input and output lines in order to increase data access speed. The input and output lines are separately controlled by clamp devices that clamp low voltage levels on the input and output lines to voltages between a ground potential and a power supply voltage. The clamping devices are enabled during read operations by feeding back the output data from a sense amplifier coupled to the input and output lines. The sense amplifier senses and amplifies the voltage difference of the input and output lines. The feedback control signal from the sense amplifier eliminates DC current paths while the voltage of the input and output lines are toggled between high and low states. The voltage control circuit increases operation speed and reduces current consumption in the memory device.

Abstract: An integrated circuit memory device includes a plurality of memory units arranged in an array of columns and banks. Each of the memory units includes a memory cell, and a bit line coupled to the memory cell wherein the bit line receives a bit of information from the memory cell. Each of a plurality of global column selection lines extends along a respective column of the memory units through each of the banks. A column decoder generates global column selection signals on the plurality of global column selection lines. Each of a plurality of input/output lines extends along a respective bank of the memory units. In addition, each of a plurality of memory unit selection circuits connects a respective bit line of a respective memory unit to a respective input/output line in response to a global column selection signal on the respective global column selection line and a bank selection column address signal.

Abstract: A low power semiconductor memory device for minimizing power consumption is disclosed. The low power semiconductor memory device includes a memory cell array with a plurality of memory cells connected to a pair of bit lines, and having first and second pairs of data lines each having a normal data line and a complementary data line. The device further includes a first switching circuit for switch-connecting the pair of bit lines to the first pair of data lines in response to column select information and a sense amplifier connected to the pair of bit lines within the memory cell array. A driving circuit transfers external data to one of the normal data line and the complementary data line of the second pair of data lines in response to a write master signal.

Abstract: A semiconductor memory device includes at least four memory cell array blocks, each having an array of memory cells, row and column decoders for selecting a memory cell designated by a row and column address, an I/O line for inputting/outputting data of the memory cell array block, and an I/O driver connected to the I/O line for selectively driving data to/from a selected memory cell. A first data line transmits the data, being connected between the I/O driver of one memory cell array block and the I/O driver of another memory cell array block oppositely arranged with respect to a central portion of the semiconductor memory device. A second data line transmits the data by connecting the first data lines of at least two memory cell array blocks disposed adjacent to each other. A data sense amplifier, connected to the second data line, senses and amplifies the data, and a data output unit, connected to the data sense amplifier, outputs the amplified data to an external lead frame.

Abstract: An integrated circuit memory device includes a plurality of memory cells, a plurality of data lines, a memory cell selector, and a memory cell connector. The memory cells are arranged in a matrix of rows and columns wherein the plurality of memory cells are further grouped in banks with each bank including at least two rows of memory cells. Each of the data lines extends along one of the columns of memory cells so that each of the data lines extends along memory cells from each of the banks of memory cells. The memory cell selector includes a row decoder which selects one of the plurality of rows, a column decoder which selects one of the plurality of columns, and a bank decoder which selects one of the banks. The connector connects one of the memory cells to a respective data line in response to the memory cell selector. Accordingly, data from only one of the memory cells is provided on a respective one of the data lines at any point and time.

Abstract: Disclosed is a burn-in test circuit and method of a semiconductor memory device which is capable of applying a stress voltage simultaneously to a plurality of word lines and which is operative when the device is in either a wafer or package state. The disclosed burn-in test circuit and method includes the capability of fusably disabling burn-in test operations in the memory device once the burn-in test is completed. The burn-in test circuit includes a burn-in enable signal generator for receiving a predetermined timing of external signals by which the burn-in test is selected, and for generating a burn-in enable signal in response. A row address decoder, responsive to the burn-in enable signal, places the word lines of the device in a high-impedance state so that a word line stress input unit can simultaneously apply a stress voltage to the word lines to perform the burn-in test. Upon completion of the burn-in test, the burn-in enable signal generator fusably disables the burn-in enable signal.

Abstract: A test control circuit and method for performing a standardized test in a semiconductor memory device which has a structure such that it is difficult to perform a test operation using a standardized test mode.