Abstract: A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: A method for adjusting processing capabilities of an electronic apparatus is provided. The method includes the steps of determining a first boost value for one or more processors according to a first slack time of the processors within a current display refresh interval, and adjusting a processing capability of the processors according to the first boost value.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: A display apparatus is provided. The display apparatus includes a detector and a controller. The detector is arranged for detecting motion of the display apparatus to identify an activity of a user of the display apparatus, and accordingly generating an identification result. The controller is coupled to the detector, and is arranged for determining a display resolution of the display apparatus according to the identification result.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature by using a source in the measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature using the tool setting parameter. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: An electronic apparatus including a display device and a controller is provided. The display device selectively displays one of a plurality of pages of an application, which make up a user interface of the application. The controller determines a hardware setting that was previously applied to the displayed page, and allocates one or more hardware resources of the electronic apparatus to the application according to the hardware setting.

Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature by using a source in the measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature using the tool setting parameter. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.

Abstract: A method for processing hardware or software service requests, applied in a first electronic device, including: receiving a first hardware or software service request; determining whether there is a need to use hardware or software of a second electronic device to process the first hardware or software service request; transmitting the first hardware or software service request to the second electronic device when there is a need to use the hardware or software of the second electronic device; receiving a first response message from the second electronic device, wherein the first response message indicates that the hardware or software of the second electronic device provides the first hardware or software service; and providing the first hardware or software service according to the first response message.

Abstract: A method is provided for validating measurement data, such as data obtained from a scanning electron microscope using in a semiconductor fabrication facility. The method includes applying a signal on a material feature by using a source in a measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain the measurement data, calculating a simulated response signal by a smart, and validating the measurement data by comparing the collected response signal with the simulated response signal. The system also includes a design database having a design feature, a measurement tool collecting a response signal, and a smart review engine configured to connect the measurement tool and the design database.

Abstract: A method for manufacturing a semiconductor device is provided and comprises steps as follows. A Si substrate is provided. The Si substrate includes a first region and a second region. A sacrificial oxide layer is formed on the substrate with respect to the first region. A sacrificial nitride layer is conformally formed on the sacrificial oxide layer and on the substrate with respect to the second region. A photoresist layer is coated over the sacrificial nitride layer. A shallow trench isolation (STI) mask is provided. The STI mask has at least one first STI pattern and at least one second STI pattern to be transferred to the Si substrate to form at least one first trench and at least one second trench in the substrate. A STI oxide layer is deposited. A chemical-mechanical polishing (CMP) process is performed until the sacrificial oxide layer is removed.

Abstract: A method and computer program are provided for analyzing a set of layers within an integrated circuit design to determine a set of critical points for each layer within the set of layers. The critical points are based at least in part on manufacturer specific process parameters. The method includes assigning a critical point value to each of the critical points within each set of critical points, analyzing a path through the integrated circuit design across multiple integrated circuit design layers, and determining a sum of critical point values of each critical point along the path.

Abstract: A method and computer program are provided for analyzing a set of layers within an integrated circuit design to determine a set of critical points for each layer within the set of layers. The critical points are based at least in part on manufacturer specific process parameters. The method includes assigning a critical point value to each of the critical points within each set of critical points, analyzing a path through the integrated circuit design across multiple integrated circuit design layers, and determining a sum of critical point values of each critical point along the path.

Abstract: A wireless signal receiving system, having an antenna, for receiving a wireless signal comprising a channel. The system also includes a tuner, coupling to the antenna, for converting the frequency of the wireless signal to generate a conversion signal. In addition, the system includes a processing unit, coupling to the tuner, for controlling the signal receiving direction of the antenna to detect the wireless signals of a first direction and a second direction, using the tuner to generate a first conversion signal and a second conversion signal so as to obtain a first reference value and a second reference value, and generating a control signal according to the first reference value and the second reference value to control the selected receiving direction of the antenna while the antenna is to receive the wireless signal of the channel.

Abstract: A method of designing an IC design layout having similar patterns filled with a plurality of indistinguishable dummy features, in a way to distinguish all the patterns, and an IC design layout so designed. To distinguish each pattern in the layout, deviations in size and/or position from some predetermined equilibrium values are encoded into a set of selected dummy features in each pattern at the time of creating dummy features during the design stage. By identifying such encoded dummy features and measuring the deviations from image information provided by, for example, a SEM picture of a wafer or photomask, the corresponding pattern can be located in the IC layout. For quicker and easier identification of the encoded dummy features from a given pattern, a set of predetermined anchor dummy features may be used.

Abstract: A method of designing an IC design layout having similar patterns filled with a plurality of indistinguishable dummy features, in a way to distinguish all the patterns, and an IC design layout so designed. To distinguish each pattern in the layout, deviations in size and/or position from some predetermined equilibrium values are encoded into a set of selected dummy features in each pattern at the time of creating dummy features during the design stage. By identifying such encoded dummy features and measuring the deviations from image information provided by, for example, a SEM picture of a wafer or photomask, the corresponding pattern can be located in the IC layout. For quicker and easier identification of the encoded dummy features from a given pattern, a set of predetermined anchor dummy features may be used.

Abstract: A positioning mechanism mounted in a travel bag retractable handle for locking inner tube to a respective outer tube is disclosed to include a holder block member, a latch member horizontally supported on an elastic member and movable in and out of the holder block member, a push member coupled to and movable along a vertical track of the holder block member and supported on an elastic member at the top of the holder block and controllable by a spring-supported press member of the travel bag retractable handle to move the latch member in an out of the holder block member between an extended locking position and a received unlocking position.

Abstract: A wireless signal receiving system, having an antenna, for receiving a wireless signal comprising a channel. The system also includes a tuner, coupling to the antenna, for converting the frequency of the wireless signal to generate a conversion signal. In addition, the system includes a processing unit, coupling to the tuner, for controlling the signal receiving direction of the antenna to detect the wireless signals of a first direction and a second direction, using the tuner to generate a first conversion signal and a second conversion signal so as to obtain a first reference value and a second reference value, and generating a control signal according to the first reference value and the second reference value to control the selected receiving direction of the antenna while the antenna is to receive the wireless signal of the channel.