Abstract: This disclosure relates to a method for manufacturing a battery module that includes the following steps: providing a plurality of battery units; providing a collector plate and an insulation layer disposed on the collect plate; contacting the insulation layer to a plurality of terminals of the plurality of battery units; and performing laser welding on a portion of the insulation layer that is in contact with the plurality of terminals to make the collector plate electrically connect the plurality of terminals.

Abstract: A wound dressing includes a substrate, an insulating layer, at least one ion sustainable-released body, and at least one electrode. The insulating layer is disposed on the substrate, with the at least one ion sustainable-released body being uniformly disposed at the insulating layer. The ion sustainable-released body includes ions. The electrode is disposed on the insulating layer, and the electrode and the ions are functioned as an electron donor and an electron acceptor respectively.

Abstract: A radio frequency identification system comprising: a measuring assembly configured to measure a physical quantity of an object to output a first data associated with the object, a loop antenna configured to be attached to the object, wherein the loop antenna has an IC chip storing a second data associated with the object, a radiation pattern disposed at the measuring assembly and a transreceiver in signal-transmittable connection to the measuring assembly, with the transreceiver configured to perform at least one of sending the first data and receiving the second data when the loop antenna and the radiation pattern are electromagnetically coupled to each other, wherein the IC chip stores the first data when the transreceiver sends the first data, and the measuring assembly receives the second data and outputs a message having the first data and the second data when the transreceiver receives the second data.

Abstract: The disclosure provides an identification tag including a bag body, an identification substance, and an identification component. The bag body is configured to be disposed on a product, and has a chamber. The identification substance is stored in the chamber. The identification substance is colored, and the state of the identification substance is changeable with temperature. When the identification substance is changed from one of the states to the other of the states, the identification substance has a volume increase and causes at least one crack on the bag body, wherein the at least one crack is connected to the chamber.

Abstract: A radio frequency identification system comprising: a measuring assembly configured to measure a physical quantity of an object to output a first data associated with the object, a loop antenna configured to be attached to the object, wherein the loop antenna has an IC chip storing a second data associated with the object, a radiation pattern disposed at the measuring assembly and a transreceiver in signal-transmittable connection to the measuring assembly, with the transreceiver configured to perform at least one of sending the first data and receiving the second data when the loop antenna and the radiation pattern are electromagnetically coupled to each other, wherein the IC chip stores the first data when the transreceiver sends the first data, and the measuring assembly receives the second data and outputs a message having the first data and the second data when the transreceiver receives the second data.

Abstract: A circuit wire crossing structure, comprising a substrate with a supporting surface, an electrical circuit disposed on the supporting surface of the substrate, with the electrical circuit comprising, two lateral wires with one of the wires having a first terminal and a second terminal and another one of the lateral wires having a second terminal, wherein the first terminal and the second terminal are spaced apart from each other, and a central wire, disposed between and apart from the first terminal and the second terminal, and an electronic component arranged above the supporting surface and two terminals of the electronic component connecting with the first terminal and the second terminal, wherein the electronic component has an insulating shell facing the central wire, and an orthographic projection of the electronic component to the supporting surface extends across an orthographic projection of the central wire to the supporting surface.

Abstract: The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract: The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.

Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract: Disclosed are methods and compositions for aqueous electrodeposition of rare earth-transitional metal alloys comprising samarium-cobalt. Also disclosed are nanostructured magnetic coatings comprising a magnetic alloy of a rare earth metal, namely samarium, and a transition metal, namely cobalt.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one embodiment a kit for carrying out the binding of metals to a substrate is provided, comprising: a container comprising a heat-resistant organic molecule derivatized with an attachment group Y and a binding group X, the binding group X promotes binding of metals; and instructional materials teaching coupling the organic molecule to the substrate by heating the molecule and/or the surface to a temperature of at least 25° C.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Abstract: The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various applications including but not limited to electronics manufacturing, printed circuit board manufacturing, metal electroplating, the protection of surfaces against chemical attack, the manufacture of localized conductive coatings, the manufacture of chemical sensors, for example in the fields of chemistry and molecular biology, the manufacture of biomedical equipment, and the like. In another aspect, the present invention provides a printed circuit board, a printed circuit board, comprising: at least one metal layer; a layer of organic molecules attached to the at least one metal layer; and an epoxy layer atop said layer of organic molecules.